Interposer and FOWLP Market – Global Forecast to 2029
インターポーザー型＆ファンアウト型ウェハーレベルパッケージング市場 : パッケージングコンポーネントと設計 (シリコン、有機、ガラス、セラミック)、実装 (2.5D、3D)、デバイス (ロジック IC、LED、メモリデバイス、MEMS、イメージング＆オプトエレクトロニクス)、業界 – 2029年までの世界予測
Interposer and Fan-out Wafer Level Packaging Market by Packaging Component & Design (Silicon, Organic, Glass, Ceramic), Packaging (2.5D, 3D), Device (Logic ICs, LEDs, Memory Devices, MEMS, Imaging & Optoelectronics), Industry – Global Forecast to 2029
The global interposer and FOWLP market is expected to be valued at USD 35.6 billion in 2024 and is projected to reach USD 63.5 billion by 2029; it is expected to grow at a CAGR of 12.3% from 2024 to 2029.
世界のインターポーザー型＆ファンアウト型ウェハーレベルパッケージング市場は、2024年に356億米ドルと評価され、2029年までに635億米ドルに達すると予測されています。 2024 年から 2029 年にかけて 12.3% の CAGR で成長すると予想されています。
Increasing demand for advanced packaging in AI and high-performance computing serves as a significant driver for the Interposer and FOWLP market.
Key Benefits of Buying the Report
§ Analysis of key drivers (Rising trend of miniaturization and form factor requirements; Increasing demand for advanced packaging in AI and high-performance computing; Growing demand for consumer electronics and gaming devices; Cost advantages offered by advanced packaging), restraints (Environmental concerns due to the usage of certain materials and chemicals; Complex manufacturing process), opportunities (Growing demand for IoT devices and wearables; Integration of advanced electronics in automobiles), and challenges (Thermal issues in wafer level packaging; Complexities in supply chain) influencing the growth of the Interposer and FOWLP market.
• Product Development/Innovation: Detailed insights on upcoming technologies, research and development activities, and new product launches in the Interposer and FOWLP market
• Market Development: Comprehensive information about lucrative markets – the report analyses the Interposer and FOWLP market across varied regions.
• Market Diversification: Exhaustive information about new products/services, untapped geographies, recent developments, and investments in the Interposer and FOWLP market
• Competitive Assessment: In-depth assessment of market shares, growth strategies, and service offerings of leading players like Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), SK HYNIX INC. (South Korea), ASE Technology Holding Co., Ltd. (Taiwan), Amkor Technology (US), among others in the interposers and FOWLP market.
インターポーザー型＆ファンアウト型ウェハーレベルパッケージング市場 : 2029年までの世界予測