| 出版社 | Market Research Future |
| 出版年月 | 2025年8月 |
New Packages and Materials for Power Devices Market Research Report
パワーデバイス向けの新しいパッケージと材料市場調査レポート : 製品タイプ [チップオンボード（COB）、ワイヤボンディングパッケージ、シリコンカーバイド（SIC）、窒化ガリウム（GaN）、ガリウムヒ素（GaAs）、その他]、用途別（自動車、コンシューマーエレクトロニクス、IT・通信、軍事・航空宇宙、産業、その他）、地域別（北米、欧州、アジア太平洋、ラテンアメリカ、中東・アフリカ）2032年までの予測
パワーデバイス向けの新パッケージおよび材料の世界市場は、2032年までに59億2,870万米ドルに達すると予測されており、2024年から2032年にかけて年平均成長率（CAGR）9.44%で成長します。パワーデバイス向けの新パッケージおよび材料とは、高度な半導体パッケージング技術と、ワイドバンドギャップ半導体（SiC、GaN）などの革新的な材料によって性能を向上させる技術を指します。これらの開発は、自動車、再生可能エネルギー、民生用電子機器などの産業で使用されるパワーエレクトロニクスの効率、熱管理、信頼性を向上させます。
パワーデバイス市場における最も注目されているトピックの一つは、業界全体におけるエネルギー効率の高いソリューションへのニーズです。効率的かつ高速でありながら、小型の電力需要は、チップスケールパッケージ（CSP）やシステムインパッケージ（SiP）といった新しいパッケージング技術の普及を促しています。
Market Overview
The global new packages and materials for power devices market is projected to reach USD 5,928.7 million by 2032, growing at a CAGR of 9.44% from 2024 to 2032. New packages and materials for power devices refer to advanced semiconductor packaging techniques and innovative materials like wide bandgap semiconductors (SiC, GaN) that enhance performance. These developments improve efficiency, thermal management, and reliability of power electronics used in industries such as automotive, renewable energy, and consumer electronics.
One major factor among the most trending topics in the New Packages and Materials for Power Devices Market is the need for energy-efficient solutions across the industries. Power demands that are efficient and fast, but small, are leading to the penetration of new packaging technologies such as chip-scale packages (CSP) and system-in-package (SiP).
Key Company Development
Microchip Technology (Nasdaq: MCHP) has extended its scope through expansion and new partnerships to gain a greater hold over the global semiconductor market. In March 2023, it commissioned a milestone in its $800 million project that will see the Oregon factory’s output increase threefold. One was a design center in Cambridge, created in December 2023. In April 2024, a partnership with TSMC in Japan was designed to further 40nm capacity, supply chain resilience, manufacturing diversity, and advanced technology development.
Major Players
Key players in the global new packages and materials for power devices market are Infineon Technologies AG, STMicroelectronics, ROHM Semiconductor, Texas Instruments, Mitsubishi Electric Corporation, NXP Semiconductors, Analog Devices, ON Semiconductor, Microchip Technology Inc., and Wolfspeed.
Report Attribute Details
- Market Size 2023: USD 2,500 Million
- Market Size 2032: USD 5,928.7 Million
- CAGR (2024-2032): 9.44%
- Base Year: 2023
- Market Forecast Period: 2024-2032
Market Segmentations
- By Product Type: Chip-On-Board (COB) – 9.66%, Wire Bonding Packaging – 8.56%.
- By Application: Automotive – 8.49%, Consumer Electronics – 10.18%.
Regional Insights
The market prospects for new packages and materials for power devices in North America are positive. The region’s growth is led by technological breakthroughs in electric mobility, consumer electronics, and industrial automation. In 2023, North America recorded USD 469.17 million from the U.S. and USD 32.08 million from Canada, highlighting steady growth in advanced power device adoption.
Europe is making steady progress, with it being forecasted to increase from USD 472.50 million in 2023 to USD 1,152.54 million by 2032, at a 9.79% CAGR. The continent is benefiting from severe sustainability rules and a good automotive and industrial sectors, which are embracing such suppliers as SiC and GaN. Europe’s market reached notable figures with Germany at USD 125.73 million, France at USD 88.40 million, and the UK at USD 92.94 million, reflecting strong demand across key economies.
The Asia-Pacific region is the largest market holder and will keep its dominance. The presence of leading semiconductor foundries, large-scale industrial growth, and government initiatives supporting 5G, EVs, and renewable energy are the main contributors to the region’s growth. Asia-Pacific dominated with China at USD 738.29 million, Japan at USD 104.37 million, and India at USD 29.20 million, underscoring its role as the global growth leader.
The Middle East & Africa market is set to experience remarkable growth. Global players like Infineon Technologies and ON Semiconductor are targeting high-potential areas such as energy, telecommunications, and defense, capitalizing on the growing need for reliable, efficient power devices in emerging economies.
South America’s market value is estimated to grow from USD 157.75 million in 2023 to USD 331.41 million by 2032, at a CAGR of 7.97%. Companies, including STMicroelectronics and ON Semiconductor, are focusing on building stronger distribution and localized manufacturing networks. These initiatives position South America as a promising market for modern packaging technologies and advanced power device materials.