積層セラミックコンデンサ(MLCC)市場シェア分析、業界動向と統計、成長予測 2026-2031年

積層セラミックコンデンサ(MLCC)市場シェア分析、業界動向と統計、成長予測 2026-2031年

Multilayer Ceramic Capacitor (MLCC) - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2026 - 2031)

積層セラミックコンデンサ(MLCC)市場レポート:誘電体タイプ(クラス1、クラス2)、ケースサイズ(0.201、0.402、0.603、1.005、1.210など)、定格電圧(低電圧、中電圧など)、実装タイプ(表面実装、メタルキャップ、ラジアルリード)、エンドユーザー(自動車、民生用電子機器、産業機器など)、地域別

Multilayer Ceramic Capacitor (MLCC) Market Report: Segmented by Dielectric Type (Class 1, and Class 2), Case Size (0 201, 0 402, 0 603, 1 005, 1 210, and More), Voltage Rating (Low-Range Voltage, Mid-Range Voltage, and More), Mounting Type (Surface-Mount, Metal-Cap, and Radial-Lead), End User (Automotive, Consumer Electronics, Industrial, and More), and Geography


出版 Mordor Intelligence
出版年月 2026年03月
ページ数 173
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 シングルユーザ USD 4,750
種別 英文調査報告書
商品番号 SMR-21586


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積層セラミックコンデンサ(MLCC)市場は2025年に272億6,000万米ドル、2026年に318億7,000万米ドル規模となり、2026年から2031年まで年平均成長率(CAGR)15.03%で成長し、2031年には641億9,000万米ドルへ拡大するとMordor Intelligenceでは予測しています。

Mordor Intelligence(モードーインテリジェンス)「積層セラミックコンデンサ(MLCC)市場レポート:誘電体タイプ(クラス1、クラス2)、ケースサイズ(0.201、0.402、0.603、1.005、1.210など)、定格電圧(低電圧、中電圧など)、実装タイプ(表面実装、メタルキャップ、ラジアルリード)、エンドユーザー(自動車、民生用電子機器、産業機器など)、地域別 – Multilayer Ceramic Capacitor (MLCC) Market Report: Segmented by Dielectric Type (Class 1, and Class 2), Case Size (0 201, 0 402, 0 603, 1 005, 1 210, and More), Voltage Rating (Low-Range Voltage, Mid-Range Voltage, and More), Mounting Type (Surface-Mount, Metal-Cap, and Radial-Lead), End User (Automotive, Consumer Electronics, Industrial, and More), and Geography」は積層セラミックコンデンサ(MLCC)の世界市場を調査し、主要セグメント別に分析・予測を行っています。

調査対象セグメント

  • 誘電体材料の種類
    • Class. 1(低誘電率系)
    • Class 2(高誘電率系)
  • ケースサイズ
    • 0 201
    • 0 402
    •  0 603
    • 1 005
    • 1 210
    • その他のケースサイズ
  • 定格電圧
    • 低電圧(500V未満
    • 中電圧(500~1000V)
    • 高電圧(1000V超)
  • 実装タイプ
    • 表面実装型
    • メタルキャップ型
    • ラジアルリード型
  •  用途
    • 航空宇宙・防衛
    • 自動車
    • 民生用電子機器
    • 産業機器
    • 医療機器
    • 電力・公益事業
    • 通信機器
    • その他の用途
  • 地域
    • 北米
      • 米国
      • その他の北米
    • 欧州
      • ドイツ
      • その他の欧州
    • アジア太平洋地域
      • 中国
      • 日本
      • 韓国
      • インド
      • その他のアジア太平洋地域
    • その他の地域(RoW)

この成長軌道は、自動車の電動化、人工知能インフラ、エッジコンピューティングの融合に伴う受動部品需要の急増を反映しており、既存のサプライチェーンに継続的な圧力をかけています。クラス1の耐熱性誘電体は、安全性が重視される設計において引き続き注目を集めており、0402パッケージは、絶対的な設置面積の削減よりも超低等価直列インダクタンスを重視する高性能サーバーにおいて、好ましいフォームファクタになりつつあります。地理的に分散した海外生産拠点の活用により、インドと東南アジアで生産能力が拡大していますが、AEC-Q200規格部品の認証取得に長い時間がかかるため、短期的な供給は逼迫しています。競争力学は、チタン酸バリウム粉末とニッケル電極冶金を支配する垂直統合型のリーダー企業に有利に働く。特に、ニッケルとパラジウムの価格変動が多層セラミックコンデンサ市場全体のコストリスクを高めているため、その傾向は顕著であります。

レポートの主要ポイント

  • 誘電体タイプ別に見ると、2025年の積層セラミックコンデンサ(MLCC)市場において、クラス1 MLCCが売上高の62.69%を占め、市場を牽引しました。また、クラス1 MLCCは、このセグメント内で最も高い成長率を記録し、2031年まで年平均成長率(CAGR)15.83%で成長すると予測されています。
  • ケースサイズ別に見ると、2025年の積層セラミックコンデンサ(MLCC)市場において、0201サイズが売上高の56.48%を占めました。 0402サイズは最も成長率の高いパッケージサイズであり、2031年まで年平均成長率(CAGR)16.02%で拡大すると予測されています。
  • 電圧定格別に見ると、500V以下の低電圧部品が2025年のMLCC市場売上高の59.34%を占めました。500V~1,000Vの中電圧部品は最も力強い成長を示し、2031年まで年平均成長率15.46%で成長すると予測されています。
  • 実装タイプ別に見ると、表面実装技術が2025年に41.71%のシェアを占めました。メタルキャップタイプは最も急成長しており、2031年まで年平均成長率15.67%で推移すると予測されています。
  • 最終用途別に見ると、民生用電子機器が2025年の売上高の51.46%を占めました。車載用途が最も急速に成長しており、2026年から2031年にかけて年平均成長率19.63%を記録しています。
  • 地域別に見ると、2025年のMLCC市場の世界収益の57.69%をアジア太平洋地域が占める見込みです。北米は最も成長著しい地域であり、2031年まで年平均成長率(CAGR)16.07%で拡大すると予測されています。

Multilayer Ceramic Capacitor (MLCC) Market Analysis by Mordor Intelligence

The multilayer ceramic capacitor (MLCC) market size is projected to expand from USD 27.26 billion in 2025 and USD 31.87 billion in 2026 to USD 64.19 billion by 2031, registering a 15.03% CAGR between 2026 and 2031. The growth trajectory reflects surging demand for passive components as vehicle electrification, artificial-intelligence infrastructure, and edge computing converge, placing sustained pressure on legacy supply chains. Class 1 temperature-stable dielectrics continue to gain traction in safety-critical designs, while 0402 packages are becoming the preferred form factor for high-performance servers that prize ultra-low equivalent series inductance over absolute footprint savings. Geo-diversified friend-shoring is unlocking incremental capacity in India and Southeast Asia, yet long qualification cycles for AEC-Q200 parts keep near-term supply tight. Competitive dynamics favor vertically integrated leaders that control barium-titanate powders and nickel electrode metallurgy, especially as volatility in nickel and palladium prices raises cost risk across the multilayer ceramic capacitor market.

Key Report Takeaways

  • By dielectric type, Class 1 MLCCs led with 62.69% revenue share revenue of the multilayer ceramic capacitor (MLCC) market in 2025. Class 1 MLCCs also recorded the highest growth outlook within this segmentation, advancing at a 15.83% CAGR through 2031.
  • By case size, the 0201 format captured 56.48% share of 2025 revenue of the multilayer ceramic capacitor (MLCC) market. The 0402 format is the fastest-growing case size, expanding at a 16.02% CAGR to 2031.
  • By voltage rating, low-voltage parts below 500 V represented 59.34% of revenue of the MLCC market in 2025. Mid-voltage parts between 500 V and 1,000 V post the strongest momentum, rising at a 15.46% CAGR through 2031.
  • By mounting type, surface-mount technology held 41.71% share in 2025. Metal-cap variants show the sharpest climb, moving at an 15.67% CAGR to 2031.
  • By end-use application, consumer electronics accounted for 51.46% of revenue in 2025. Automotive applications are growing the quickest, registering a 19.63% CAGR during 2026-2031.
  • By geography, Asia-Pacific dominated with 57.69% of worldwide revenue of the MLCC market in 2025. North America is the fastest-advancing region, expanding at a 16.07% CAGR to 2031.

Note: Market size and forecast figures in this report are generated using Mordor Intelligence’s proprietary estimation framework, updated with the latest available data and insights as of January 2026.

Global Multilayer Ceramic Capacitor (MLCC) Market Trends and Insights

積層セラミックコンデンサ(MLCC)市場シェア分析、業界動向と統計、成長予測 2026-2031年 - Drivers Impact Analysis

Multilayer Ceramic Capacitor (MLCC) Market – Drivers Impact Analysis

800 V EV Architectures Accelerate Demand for High-Voltage MLCCs

Automakers shifting to 800 V battery platforms need MLCCs that withstand ≥1,000 V operating margins, prompting suppliers to thicken nickel-palladium electrodes and refine sub-micrometer dielectric deposition. Samsung Electro-Mechanics released a 2,000 V X7R family in 2025 for silicon-carbide inverters, while Murata’s GCM32 series pairs 1,000 V ratings with 100 nH equivalent series inductance for noise suppression.[1] IDTechEx expects 800 V vehicles to represent 40% of production by 2028, lifting MLCC content per car by roughly one-quarter.[2] Qualification bottlenecks persist because automotive-grade life testing still spans 1,000 hours at 150 °C, yet suppliers mastering these hurdles enjoy premium pricing in the multilayer ceramic capacitor (MLCC) market.

Gen-AI Server Build-Out Spurs Ultra-Low-ESL, High-CV MLCC Adoption

Inference accelerators drawing 700 W per socket create voltage transients that demand 0402 MLCCs positioned within 2 mm of the die. Murata began shipping a 47 µF 4 V 0402 device in July 2025 that stacks 800 layers only 0.6 µm thick.[3] KYOCERA AVX doubled capacity for its low-ESL server portfolio because each GPU board now carries up to 3,000 capacitors, far above CPU systems. TrendForce reported 35% MLCC unit growth in servers during 2025, well ahead of server shipment growth.[4] Japanese precision houses therefore widen their lead as defect rates climb when active layers exceed 600.

On-Device AI and Advanced Wearables Require Sub-1005 Miniature MLCCs

Smartphones integrating neural engines and wearables housing health sensors need 0201 and even 01005 sizes, but shrinking below 0402 compresses electrode spacing, elevating dielectric breakdown risk. Murata introduced a 0.22 µF 6.3 V 0201 MLCC in 2025 whose barium-titanate grains measure under 50 nm. KYOCERA AVX followed with a 10 µF 0402 line for fitness trackers. Only a handful of suppliers possess the photolithography-grade clean rooms necessary for such geometries, concentrating production and extending lead times across the multilayer ceramic capacitor (MLCC) market.

Geo-Diversified Friend-Shoring of Passive-Component Supply Chains

Manufacturers now mandate at least one non-China source, steering investment to India, the Philippines, and Eastern Europe. Murata committed USD 340 million to a Krishnagiri, India, plant that entered volume production in 2025. Samsung Electro-Mechanics allocated USD 150 million to its Bulacan, Philippines, campus, and TDK consolidated Southeast Asian logistics to meet regional-content rules. Although new fabs raise near-term costs by up to 30%, they hedge geopolitical risk and qualify for incentives in the United States CHIPS and Science Act and the European Union Chips Act.

Volatile Nickel and Palladium Prices Inflate BOM Costs

Nickel spiked 42% in early 2024 after Indonesian export curbs, then swung 18% lower by late 2025, while palladium fluctuated between USD 900 and USD 1,400 per troy ounce amid Russian supply uncertainty. A 10% rise in electrode-metal cost lifts finished MLCC bills by 3-5%, squeezing suppliers in consumer tiers where annual price erosion already approaches 8%. TDK said raw-material inflation trimmed its passive-component margin by 120 bps in fiscal 2026, accelerating copper electrode substitution.[6] Murata is renegotiating quarterly price clauses tied to nickel futures, passing some risk to data-center clients. Smaller Asian suppliers without hedging programs cut automotive output in late 2025, deepening shortage conditions.

Persistent Capacity Mismatch for Automotive-Grade MLCCs

AEC-Q200 qualification still demands 1,000-hour high-temperature life and extreme thermal shock, extending ramp schedules to 18-24 months. Samsung Electro-Mechanics reported 26-week lead times in early 2025 even at full utilisation, prioritising electric-vehicle orders over legacy platforms. Murata’s Shimane expansion will add 25% capacity but will not complete qualification until late 2027. Automakers therefore pay 30-50% premiums or freeze designs early, while agile suppliers that co-locate test labs enjoy a competitive edge. The imbalance keeps the multilayer ceramic capacitor (MLCC) market for automotive parts structurally tight despite headline capacity announcements.

*Our forecasts treat driver/restraint impacts as directional, not additive. The impact forecasts reflect baseline growth, mix effects, and variable interactions.

Segment Analysis

By Dielectric Type: Temperature Stability Drives Class 1 Resurgence

Class 1 devices accounted for 62.69% multilayer ceramic capacitor (MLCC) market share in 2025, reflecting automakers’ need for drift-free performance over 15-year vehicle lifespans. The segment is set to grow at a 15.83% CAGR, faster than the broader multilayer ceramic capacitor market size, as wide-bandgap inverters and medical electronics migrate to zero-temp-coefficient ceramics. Murata’s 1,250 V C0G series exemplifies the shift toward thicker electrodes that combat electromigration while maintaining sub-ppm temperature tracking. In contrast, Class 2 barium-titanate parts still dominate smartphones because their higher volumetric efficiency offsets aging losses, yet they lose share in safety-critical designs.

The trade-off between board real estate and stability remains central. Class 1 capacitors occupy up to five times the footprint of Class 2 equivalents, yet predictable capacitance eliminates costly design margins, which matters in ISO 26262-compliant powertrain control units. Regulatory bodies do not explicitly mandate dielectric selection, but AEC-Q200 life testing implicitly steers designs toward Class 1 formulations. Consequently, the MLCC market continues to bifurcate: high-value automotive and industrial nodes lean on Class 1 stability, while consumer electronics retain Class 2 density.

By Case Size: Miniaturization Meets Power Density in 0402 Surge

The 0201 footprint captured 56.48% of the multilayer ceramic capacitor (MLCC) market in 2025, driven by smartphones and wearables chasing sub-millimetre components. Yet 0402 units are rising 16.02% annually, supported by AI servers that need 47 µF decoupling capacitors contiguous to 700 W GPUs. Murata’s July 2025 release of an 800-layer 0402 part doubled capacitance density over its previous generation. KYOCERA AVX followed with a 10 µF 0402 range for smart-watch modules.

Manufacturing complexity scales sharply below 0402, requiring photolithography-grade clean rooms and laser trim. This concentrates capacity among three Japanese and Korean leaders, extending lead times to 20 weeks in early 2026, while Chinese entrants compete in commoditised 0603 and 0805 lines. As GPU boards swell to 3,000 MLCCs each, supply tightness in 0402 parts is likely to persist, underpinning premium price realisation across the multilayer ceramic capacitor market.

By Voltage Rating: Mid-Voltage Segment Captures 800 V EV Wave

Low-voltage MLCCs below 500 V retained 59.34% share in 2025 thanks to phones, laptops, and servers. Mid-voltage types between 500 V and 1,000 V exhibit a 15.46% CAGR, lifting their multilayer ceramic capacitor market size as 800 V drivetrains and renewable-energy inverters scale. Samsung Electro-Mechanics’ 2,000 V X7R launch in 2025 answers silicon-carbide traction inverter needs; TDK’s 1,250 V C0G series addresses on-board chargers. High-voltage i.e., above 1,000 V parts remain niche in X-ray and photovoltaic systems yet command high margins.

Automakers see 800 V buses halving charging time and trimming copper wiring mass by up to 30%, yielding greater MLCC dollar content per vehicle. IDTechEx forecasts 40% 800 V penetration by 2028, underscoring mid-voltage momentum. Above 1,500 V, film capacitors still compete on energy density, but ceramics win where space and ESR drive architectural choice.

By Mounting Type: Metal-Cap Variants Gain in Data-Center Power Delivery

Surface-mount MLCCs delivered 41.71% of revenue in 2025 and stay dominant in consumer and automotive boards. Metal-cap designs grow 15.67% annually as data-center power planes adopt direct-attach capacitors that cut parasitic inductance by up to 60%. Murata’s 0402 metal-cap offering premiered in 2025 with 47 µF capacitance, serving Gen-AI nodes. KYOCERA AVX noted a capacity pivot toward these SKUs after orders doubled in 2025.

The metal-cap premium rests on mechanical robustness during thermal cycling and the ability to sit within 2 mm of high-amp silicon. Radial-lead parts decline as through-hole assembly wanes, though industrial retrofits keep a residual niche. The multilayer ceramic capacitor market therefore segments by assembly environment: high-speed pick-and-place favours surface mount, while high-current rails inside GPUs justify the costlier metal-cap topology.

By End-Use Application: Automotive Electrification Outpaces Consumer Electronics

Consumer electronics still led at 51.46% of 2025 revenue, yet automotive MLCC demand rises 19.63% annually as electric vehicles multiply component counts. Battery-electric cars already house 8,000-12,000 capacitors and gain 2,000-3,000 more when moving from 400 V to 800 V buses. Samsung Electro-Mechanics began shipping to BYD’s 800 V platforms in early 2026. Telecommunications sits in the low-mid-single digits, while industrial automation enjoys steady growth tied to robotics and renewables.

Medical, aerospace, and defense remain small but price-rich because they need radiation-hard or traceable lots. Power utilities deploy high-voltage MLCCs in grid inverters, albeit in modest volumes relative to automotive. As a result, car electrification pulls capital investments toward AEC-Q200 fabs, realigning the multilayer ceramic capacitor (MLCC) market around long-lifecycle, high-reliability sectors.

Geography Analysis

Asia-Pacific generated 57.69% of multilayer ceramic capacitor revenue in 2025, reflecting Japan’s mastery of precision ceramics, South Korea’s high-mix production, and China’s vast consumer-electronics export engine. Chinese factories supplied up to 75% of global MLCC output, yet geopolitical tension spurred OEMs to dual-source through Japanese, Korean, and Indian sites. Murata, TDK, and Taiyo Yuden all ran full utilisation in early 2026 and expanded capacity in the Philippines and India to satisfy friend-shoring mandates. Samsung Electro-Mechanics, likewise running at capacity, channelled parts to BYD’s 800 V vehicles while fortifying its Philippine campus.

North America is growing at 16.07% through 2031, buoyed by CHIPS and Science Act incentives that pull semiconductor and passive-component supply back onshore. Hyperscalers such as Microsoft and Amazon doubled server-grade MLCC orders during 2025, chasing ultra-low-ESL decoupling for AI accelerators. Proposed U.S. fabs remain delayed by labour cost and lengthy AEC-Q200 qualification cycles, so Mexican sites pick up overflow assembly under USMCA trade terms. Canada’s piece is small but may rise as critical-mineral policies support domestic nickel and palladium supply.

Europe held a mid-teens share in 2025, tied to Germany’s automotive corridor and Nordic renewable-energy projects. The European Union Chips Act encourages localisation, though strict RoHS and REACH standards extend qualification and inflate costs by up to 15% versus Asia. Würth Elektronik is scaling automotive-grade output, yet still imports sub-micron dielectric powders from Japan. Elsewhere, South America, the Middle East, and Africa represent a low-single-digit slice, with growth centring on Brazil’s electric-vehicle rollout and Gulf data-center builds that value low-inductance MLCCs.

Competitive Landscape

The multilayer ceramic capacitor market remains highly concentrated: Murata Manufacturing, Samsung Electro-Mechanics, and TDK Corporation controlled an estimated 60-65% of revenue in 2025. Vertical integration into barium-titanate synthesis and nickel electrode plating shields their margins from raw-material swings, while proprietary co-firing ovens enable sub-0.6 µm dielectric layers. Murata patented a copper-electrode stack under 0.5 µm in 2025 that could double capacitance density and cut electrode cost by up to 40%. Samsung Electro-Mechanics combines capacity expansion in the Philippines and Vietnam with AI-enabled defect analytics that trimmed scrap by 18% in 2025.

Mid-tier players such as Yageo and Walsin pursue M and A for automotive qualification, exemplified by Yageo’s 2024 KEMET acquisition, yet still trail in ultra-miniature nodes. Chinese entrants Sunlord and Fenghua move aggressively on price in commodity smartphones, underbidding Japanese peers by 15-25%, but remain excluded from automotive and data-center sockets that demand AEC-Q200 compliance and low-ESL metrics. As semiconductor firms embed capacitors inside chiplet substrates, a small yet growing share of demand shifts into integrated passives, presenting both a challenge and an opportunity for discrete MLCC vendors.

Barriers to entry stay formidable because AEC-Q200 and IEC 60384 protocols require component stress tests, lot traceability, and co-located life-test ovens that only capital-rich suppliers can afford. Sustainability regulation in Europe further raises hurdles, favouring companies that can certify recycled ceramic powders and lead-free terminations. Overall, scale, materials science, and qualification speed define competitive advantage across the multilayer ceramic capacitor market.

List of Companies Covered in this Report:

  • Murata Manufacturing Co., Ltd.
  • Samsung Electro-Mechanics Co., Ltd.
  • Taiyo Yuden Co., Ltd.
  • Yageo Corporation
  • TDK Corporation
  • Kyocera AVX Components Corporation
  • Walsin Technology Corporation
  • Vishay Intertechnology, Inc.
  • Würth Elektronik GmbH and Co. KG
  • Guangdong Fenghua Advanced Technology Holding Co., Ltd.
  • Maruwa Co., Ltd.
  • Samwha Capacitor Group
  • Panasonic Holdings Corporation
  • Shenzhen Torch Technology Co., Ltd.
  • Holy Stone Enterprise Co., Ltd.
  • Shenzhen Eyang Technology Development Co., Ltd.
  • Johanson Dielectrics, Inc.
  • KEMET Corporation (Yageo Group)
  • Shenzhen Sunlord Electronics Co., Ltd.
Additional Benefits:
  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

Table of Contents

1 INTRODUCTION

1.1 Study Assumptions and Market Definition
1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE

4.1 Market Overview
4.2 Market Drivers
4.2.1 800 V EV Architectures Accelerate Demand for High-Voltage MLCCs
4.2.2 Gen-AI Server Build-Out Spurs Ultra-Low-ESL, High-CV MLCC Adoption
4.2.3 On-Device AI and Advanced Wearables Require Sub-1 005 Miniature MLCCs
4.2.4 Geo-Diversified “Friend-Shoring” of Passive Component Supply Chains
4.2.5 Sustainability Mandates Favor Lead-Free and Recycled-Ceramic MLCCs
4.2.6 Semiconductor-Subsystem Co-Design Embeds MLCCs inside Chiplets
4.3 Market Restraints
4.3.1 Volatile Nickel and Palladium Prices Inflate BOM Costs
4.3.2 Persistent Capacity Mismatch for Automotive-Grade MLCCs
4.3.3 China Price-Led Offensive in Commodity MLCCs Erodes Global Margins
4.3.4 Physical Limits on Dielectric Layer Thickness (Less than 1 µm) Stall Capacitance Gains
4.4 Impact of Macroeconomic Factors on the Market
4.5 Industry Supply-Chain Analysis
4.6 Regulatory Landscape
4.7 Technological Outlook
4.8 Porter’s Five Forces Analysis
4.8.1 Threat of New Entrants
4.8.2 Bargaining Power of Suppliers
4.8.3 Bargaining Power of Buyers
4.8.4 Threat of Substitutes
4.8.5 Competitive Rivalry

5 MARKET SIZE AND GROWTH FORECASTS (VALUE)

5.1 By Dielectric Type

5.1.1 Class 1
5.1.2 Class 2

5.2 By Case Size

5.2.1 0 201
5.2.2 0 402
5.2.3 0 603
5.2.4 1 005
5.2.5 1 210
5.2.6 Other Case Sizes

5.3 By Voltage Rating

5.3.1 Low Voltage (Less than 500 V)
5.3.2 Mid Voltage (500 – 1000 V)
5.3.3 High Voltage (Above 1000 V)

5.4 By Mounting Type

5.4.1 Surface-Mount
5.4.2 Metal-Cap
5.4.3 Radial-Lead
5.5 By End-Use Application
5.5.1 Aerospace and Defense
5.5.2 Automotive
5.5.3 Consumer Electronics
5.5.4 Industrial
5.5.5 Medical Devices
5.5.6 Power and Utilities
5.5.7 Telecommunications
5.5.8 Rest of End-Use Applications

5.6 By Geography

5.6.1 North America
5.6.1.1 United States
5.6.1.2 Rest of North America
5.6.2 Europe
5.6.2.1 Germany
5.6.2.2 Rest of Europe
5.6.3 Asia-Pacific
5.6.3.1 China
5.6.3.2 Japan
5.6.3.3 South Korea
5.6.3.4 India
5.6.3.5 Rest of Asia-Pacific
5.6.4 Rest of the World

6 COMPETITIVE LANDSCAPE

6.1 Market Concentration
6.2 Strategic Moves
6.3 Market Share Analysis
6.4 Company Profiles
6.4.1 Murata Manufacturing Co., Ltd.
6.4.2 Samsung Electro-Mechanics Co., Ltd.
6.4.3 Taiyo Yuden Co., Ltd.
6.4.4 Yageo Corporation
6.4.5 TDK Corporation
6.4.6 Kyocera AVX Components Corporation
6.4.7 Walsin Technology Corporation
6.4.8 Vishay Intertechnology, Inc.
6.4.9 Würth Elektronik GmbH and Co. KG
6.4.10 Guangdong Fenghua Advanced Technology Holding Co., Ltd.
6.4.11 Maruwa Co., Ltd.
6.4.12 Samwha Capacitor Group
6.4.13 Panasonic Holdings Corporation
6.4.14 Shenzhen Torch Technology Co., Ltd.
6.4.15 Holy Stone Enterprise Co., Ltd.
6.4.16 Shenzhen Eyang Technology Development Co., Ltd.
6.4.17 Johanson Dielectrics, Inc.
6.4.18 KEMET Corporation (Yageo Group)
6.4.19 Shenzhen Sunlord Electronics Co., Ltd.

7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK

7.1 White-Space and Unmet-Need Assessment


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