アジア太平洋地域のデータセンター冷却市場シェア分析、業界動向と統計、成長予測 2026-2031年

アジア太平洋地域のデータセンター冷却市場規模は、2025年の35億6,000万米ドルから2026年には40億9,000万米ドルに拡大し、2031年には82億6,000万米ドルに達すると予測されています。2026年から2031年にかけての年平均成長率（CAGR）は15.09%です。

生成AIサーバーの普及加速、中国のPUE ≤ 1.3規制やシンガポールのSS 715:2025規格といったエネルギー効率基準の義務化、そしてマイクロソフト、グーグル、アリババ、テンセントによるハイパースケールデータセンターの構築などが、高性能冷却システムの需要拡大を後押ししています。ラックあたり30kWを超えると空冷方式は経済的・技術的な限界に達するため、液冷方式が注目を集めていますが、既存設備や30kW未満の導入においては依然として空冷方式が主流です。ハードウェア、ソフトウェア、そして迅速なプレハブ化を組み合わせたソリューションを提供するベンダーは、運用会社が構築期間を18ヶ月から6ヶ月に短縮する中で、契約を獲得しています。 2024年の鉄鋼と半導体の不足を経て、サプライチェーンのリスクは緩和されつつあるが、東南アジアにおける空調設備（HVAC）の熟練労働者不足は、依然として短期的なボトルネックとなっている。

Asia-Pacific Data Center Cooling Market Analysis

The Asia-Pacific data center cooling market size is expected to increase from USD 3.56 billion in 2025 to USD 4.09 billion in 2026 and reach USD 8.26 billion by 2031, growing at a CAGR of 15.09% over 2026-2031. Accelerating adoption of generative-AI servers, mandatory efficiency codes such as China’s PUE ≤ 1.3 rule and Singapore’s SS 715:2025 standard, and hyperscale build-outs by Microsoft, Google, Alibaba, and Tencent are expanding demand for high-performance thermal systems. Liquid architectures are gaining traction because air-based cooling reaches economic and technical limits above 30 kW per rack, yet air solutions still dominate legacy estates and sub-30 kW deployments. Vendors that combine hardware, software, and rapid prefabrication are winning contracts as operators compress build schedules from 18 months to six. Supply-chain risk is easing after 2024 steel and semiconductor shortages, but HVAC-skilled labor gaps in Southeast Asia remain a near-term bottleneck.

Asia-Pacific Data Center Cooling Market Trends and Insights

AI/Gen-AI Rack Power Densification Drives Liquid Pivot

Generative-AI clusters are lifting rack densities from 8-12 kW toward 40-60 kW, where air systems lose both cost and thermal headroom. Lenovo’s Neptune direct-to-chip platform installed at NTT’s Tokyo campus in 2025 saved 40% energy while supporting 50 kW racks, and China’s 2024 code now obliges liquid cooling above 8 kW per cabinet. Singapore’s updated SS 715 demands PUE < 1.2 for high-density halls.At densities beyond 30 kW, immersion designs eliminate chillers and cut total cost of ownership by up to 30%, although uptake is moderated by OEM warranty terms and a shortage of technicians versed in dielectric-fluid safety. The Asia-Pacific data center cooling market is therefore shifting capital toward pumps, plates, and heat-exchanger modules that underpin liquid loops.

Hyperscale Build-Outs by Cloud Majors Anchor Demand

Microsoft’s USD 17.5 billion India program and Google’s USD 15 billion Andhra Pradesh campus each require 200-300 MW of IT load, absorbing 15-20% of regional chiller output through 2027. Oracle’s multi-country region specified six-month delivery of modular mechanical blocks, accelerating orders for Vertiv and Schneider Electric. Chinese giants Alibaba and Tencent added 180 MW in 2025, drawn by land subsidies in Guangdong and Jiangsu that are conditional on 50% renewable sourcing. The hyperscale wave bifurcates the vendor field, rewarding suppliers with liquid IP and balance-sheet strength capable of vendor financing.

Rising Electricity and Land Costs Compress Margins

Singapore’s tariff climbed to SGD 0.35/kWh in 2025 (USD 0.26/kWh) and the city’s land scarcity allocates only 300 MW of extra IT load through 2030, inflating plots above SGD 1,000 ft² (USD 695 ft²). Tokyo inner districts exceed USD 15,000 m², triggering capacity shifts to Osaka despite latency penalties. Similar pressures in Sydney and Hong Kong redirect builds toward outer suburbs or Guangdong, but grid and fiber gaps undermine quick scaling. Because air cooling can represent 40% of a facility’s power bill versus 15% for liquid, cost inflation is nudging incumbents to retrofit direct-to-chip loops even on brownfield assets.

Other drivers and restraints analyzed in the detailed report include:

1. Edge Data Centers at 5G Micro-Regions Need Compact Cooling
2. Corporate Net-Zero and RE100 Pledges Elevate Efficiency
3. Water-Use Restrictions Squeeze Evaporative Architectures

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

By Cooling Technology: Liquid Designs Capture High-Density Growth

Air-based systems delivered 59.96% revenue in 2025, supported by entrenched operational know-how and a vast installed base. Yet the Asia-Pacific data center cooling market size for liquid architectures is forecast to expand at a 16.13% CAGR as generative-AI racks exceed 40 kW, a density where rear-door exchangers and immersion tanks outrun fan-driven CRAC units. Immersion deployments at Keppel Data Centres achieved PUE 1.03 and removed chillers entirely, proving a 25% capex and 40% opex cut over air baselines. Direct-to-chip loops from CoolIT allowed 50 kW retrofits in Japanese and Australian halls, adding seven years to asset life.

Despite liquid’s momentum, air cooling preserves tactical advantages below 30 kW, in climates with extended free-cooling windows, and in markets short on dielectric-fluid skills such as Indonesia and Vietnam. Daikin’s magnetic-bearing chillers reached 0.45 kW per ton in Tokyo, sustaining air’s relevance where water limits prohibit towers. The Asia-Pacific data center cooling market continues to reward hybrid estates that blend fan coils for low-density rows with pumped liquid loops for AI zones, easing migration paths for cautious operators.

By Cooling Component: Flow-Control Hardware Surges

Computer-room air handlers maintained 41.55% share in 2025, but demand is tilting toward pumps, valves, and plate heat exchangers that orchestrate liquid loops. Grundfos and Xylem introduced variable-speed pumps tailored to 35-60 °C water, securing Microsoft and Google contracts in India. Alfa Laval’s Compabloc plates hit 95% heat-transfer efficiency inside immersion shells, driving multi-megawatt orders from Singapore and Tokyo.

Chillers bifurcate between high-efficiency magnetic-bearing units for air halls and compact skid exchangers for liquid districts. Monitoring software now grows fastest at roughly 17% CAGR, with Schneider Electric EcoStruxure IT and Vertiv Trellis trimming energy 10-15% via machine-learning set-point control. As liquid penetration deepens, the Asia-Pacific data center cooling market will progressively prize precision flow hardware over bulk air movers.

By Tier Type: Tier 4 Demands Premium Redundancy

Tier 3 sites accounted for 51.74% revenue in 2025 as they balance uptime and cost. However, the Asia-Pacific data center cooling market size for Tier 4 halls is climbing at 16.73% CAGR, propelled by banks, sovereign clouds, and healthcare firms that require 2N mechanical redundancy. Singapore’s financial sector mandates Tier 4 accreditation, sustaining Johnson Controls Sabroe sales despite land constraints.

Tier 1 and Tier 2 facilities serve price-sensitive edge loads using single-path DX units. Meanwhile, Tier 3 colocation suites upgrade to N+1 liquid readiness to court AI tenants, and Tier 4 campuses integrate waste-heat exports or district loops to neutralize high capex. Regulatory overlays such as ISO 22301 uphold demand for full mechanical duality within critical national infrastructure.

By Data Center Size: Hyperscale Campuses Lead Innovation

Large halls (10-50 MW) delivered 52.12% revenue in 2025, yet hyperscale facilities exceeding 100 MW now record a 16.54% CAGR through 2031. Vertiv’s hybrid cooling in Microsoft Hyderabad marries 8 kW air rows with 50 kW liquid aisles, optimizing spend per workload. Google’s Andhra Pradesh campus adopted six-month prefab blocks, favoring suppliers able to ship fully integrated skids.

Medium (1-10 MW) and small (< 1 MW) sites stay relevant for latency-sensitive and edge workloads, adopting standardized air kits with embedded analytics. Yet hyperscale demand dictates component roadmaps, funding R and D in district chilling, waste-heat resale, and immersion chemistries that will filter down to mid-tier estates over time.

By Data Center Type: Cloud Providers Outpace Colocation

Colocation retained 53.97% revenue in 2025, but vertically integrated hyperscalers are growing at 16.88% CAGR as AWS, Azure, Google Cloud, Alibaba Cloud, and Tencent Cloud design proprietary liquid systems tuned to workload mixes. AWS Osaka delivered evaporative towers achieving WUE 0.8 L/kWh, reflecting scale-driven custom engineering. In response, Equinix and Digital Realty now offer liquid-ready suites, though amortizing capex across mixed-density tenants remains challenging.

Enterprise and edge operators prize turnkey bundles that combine cooling, UPS, and monitoring in one warranty, often selecting Vertiv or Schneider Electric. The Asia-Pacific data center cooling industry therefore exhibits a barbell structure: bespoke high-density liquids at hyperscale and standardized air kits at the periphery.

Geography Analysis

China dominated the Asia-Pacific data center cooling market with 32.64% 2025 share, underpinned by NDRC mandates for PUE ≤ 1.3 and compulsory liquids above 8 kW per rack. Provincial incentives in Guangdong and Jiangsu catalyzed 180 MW of Alibaba and Tencent additions, while Huawei Digital Power’s FusionModule 2000 immersion kits proliferated across Shenzhen and Chengdu. Rising water stress in Beijing and Tianjin, however, is pushing capacity toward inland Wuhan, Xi’an, and Chongqing where land and power cost 30-40% less.

Japan held roughly 18% share, buoyed by METI tax credits that reimburse 20% of liquid-cooling capex and delivered rapid uptake at AirTrunk and NTT campuses. Land scarcity and seismic safety codes elevate prefabricated modules and magnetic-bearing chillers, keeping air and liquid in hybrid coexistence. South Korea’s K-Green certification enforces PUE ≤ 1.4 and 30% renewables, propelling Daikin and Delta Electronics shipments across Seoul and Busan.

India is the fastest-growing territory at a 16.97% CAGR, driven by USD 17.5 billion Microsoft Azure and USD 15 billion Google builds that will absorb one-fifth of regional chiller output by 2027. Stringent water codes in Maharashtra and Karnataka advance dry coolers and sealed immersion even at a 20% capex premium. Australia and New Zealand jointly hold 15% share; New South Wales imposes WUE < 1.2 L/kWh and Victoria enforces stormwater reuse, stimulating seawater exchangers at coastal sites and liquid loops inland.

Southeast Asia, led by Singapore, Malaysia, Thailand, Indonesia, and Vietnam, represents 22% combined share. Singapore’s SS 715:2025 caps PUE at 1.2 for new halls, while Malaysia’s latest EIA rules lengthen approval by up to 18 months, narrowing the regulatory-shopping window that once favored Johor Bahru. Labor scarcity, Thailand projects 15,000 HVAC technician shortfalls could restrain install velocity despite robust demand [MOL.GO.TH]. The region therefore offers outsized growth but requires skill-development programs and water-light technologies.

Competitive Landscape

Air cooling is an oligopoly; Vertiv, Schneider Electric, and Johnson Controls together hold roughly 60% share by leveraging installed-base contracts across 15-plus countries. Each is pivoting toward liquids—Vertiv launched Liebert DSE and XDU direct-to-chip lines, while Schneider Electric rolled out EcoStruxure Cooling Advisor with predictive analytics, blending incremental air retrofit revenue with greenfield liquid wins. Johnson Controls refreshed Sabroe chillers featuring AI load prediction for financial-sector Tier 4 halls.

Liquid cooling remains fragmented. Specialists such as Submer, Iceotope, and CoolIT bring immersion and precision loops, whereas Huawei Digital Power and Delta Electronics ride domestic scale to global bids. Green Revolution Cooling reports PUE 1.03 at Keppel Data Centres yet still faces OEM warranty hesitancy and limited dielectric-fluid workforce. Market white spaces cluster in edge micro-facilities, district chilled-water schemes like Singapore Tampines, and prefabricated blocks that cut schedule by two-thirds, a model Oracle adopted across Southeast Asia.

Strategic divergence is apparent: hyperscalers vertically integrate cooling IP to protect margins, colocation giants partner with incumbent OEMs for turnkey liquid suites, and enterprises choose standardized air kits bundled with five-year service. Competitive intensity will escalate as Chinese vendors export, immersion costs fall with scale, and AI workloads proliferate. Vendors lacking flow-control IP, dielectric chemistry expertise, or AI analytics risk margin compression in the Asia-Pacific data center cooling market.

List of Companies Covered in this Report:

• Vertiv Group Corp.
• Schneider Electric SE
• STULZ GmbH
• Huawei Digital Power Technologies Co., Ltd.
• Johnson Controls International plc
• Rittal GmbH & Co. KG
• Daikin Applied (Daikin Industries, Ltd.)
• Fujitsu General Limited
• Mitsubishi Electric Corporation
• Hitachi Cooling and Heating (Johnson Controls-Hitachi Air Conditioning)
• Baltimore Aircoil Company
• Nortek Air Solutions LLC
• Delta Electronics, Inc.
• Grundfos Holding A/S
• CoolIT Systems, Inc.
• Submer Technologies, S.L.
• Iceotope Technologies Ltd.
• Alfa Laval AB
• Trane Technologies plc
• NTT Facilities, Inc.
• Xylem Inc.
• Refrion S.r.l.
• Green Revolution Cooling, Inc.
• Munters AB

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

Recent Industry Developments

• February 2026: Schneider Electric announced a partnership with Tata Communications to roll out EcoStruxure prefabricated cooling modules across 15 Indian sites, cutting build time to six months and enabling direct-to-chip support for Azure and Google loads.
• January 2026: Vertiv introduced the Liebert XDU 60 kW direct-to-chip system and shipped 5,000 units to AirTrunk Tokyo and NTT Osaka, generating USD 150 million in revenue.
• December 2025: Huawei Digital Power won a USD 200 million order for FusionModule 2000 immersion systems at China Mobile’s 50 MW Guangdong AI hub.
• November 2025: Daikin Applied expanded its Thai plant by 40% to boost Magnitude chiller output for Oracle and STT GDC contracts.

Table of Contents

1 INTRODUCTION
1.1 Study Assumptions and Market Definition
1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET LANDSCAPE
4.1 Market Overview
4.2 Market Drivers
4.2.1 AI/Gen-AI Rack Power Densification
4.2.2 Hyperscale Build-Outs by US and Chinese Cloud Majors
4.2.3 Edge Data Centers at 5G Micro-Regions
4.2.4 Corporate Net-Zero and RE100 Pledges
4.2.5 Modular Prefabricated Cooling Blocks
4.2.6 District-Cooling Integration Pilots (Singapore-Style)
4.3 Market Restraints
4.3.1 Rising Electricity and Land Costs in Tier-1 APAC Cities
4.3.2 Scarcity of HVAC-Certified Labor in Emerging Southeast Asia
4.3.3 Water-Use Restrictions in Drought-Prone India and Australia
4.3.4 Lengthy Environmental Permitting and Community Pushback
4.4 Industry Supply-Chain Analysis
4.5 Regulatory Landscape
4.6 Impact of Macroeconomic Factors on the Market
4.7 Porter’s Five Forces Analysis
4.7.1 Threat of New Entrants
4.7.2 Bargaining Power of Buyers
4.7.3 Bargaining Power of Suppliers
4.7.4 Threat of Substitute Products
4.7.5 Intensity of Competitive Rivalry

5 ANALYSIS OF THE CURRENT DATA CENTER FOOTPRINT IN ASIA-PACIFIC
5.1 Analysis of IT Load Capacity (MW) and Area footprint (Sq. Ft.) of Data Centers (for the Period of 2019-2031)
5.2 Analysis of Major Data Center Hotspots in Asia-Pacific
5.3 Analysis of Major Upcoming Hyperscale Facilities in Asia-Pacific

6 MARKET SIZE AND GROWTH FORECASTS (VALUE)
6.1 By Cooling Technology
6.1.1 Air-Based Cooling
6.1.1.1 CRAH
6.1.1.2 Chiller and Economizer
6.1.1.3 Cooling Tower (Direct, Indirect, Two-Stage)
6.1.1.4 Others
6.1.2 Liquid-Based Cooling
6.1.2.1 Immersion Cooling
6.1.2.2 Direct-to-Chip Cooling
6.1.2.3 Rear-Door Heat Exchanger
6.2 By Cooling Component
6.2.1 Computer-Room Air Handlers (CRAH/CRAC)
6.2.2 Chillers and Heat-Exchanger Units
6.2.3 Cooling Towers and Dry Coolers
6.2.4 Pumps and Valves
6.2.5 Control and Monitoring Software
6.3 By Tier Type
6.3.1 Tier 1 and 2
6.3.2 Tier 3
6.3.3 Tier 4
6.4 By Data Center Size
6.4.1 Small Data Center
6.4.2 Medium Data Center
6.4.3 Large Data Center
6.4.4 Hyperscale Data Center
6.5 By Data Center Type
6.5.1 Colocation Data Center
6.5.2 Hyperscalers Data Center/CSPs
6.5.3 Enterprise and Edge Data Center
6.6 By Country
6.6.1 China
6.6.2 Japan
6.6.3 India
6.6.4 South-Korea
6.6.5 Australia and New Zealand
6.6.6 Rest of Asia-Pacific

7 COMPETITIVE LANDSCAPE
7.1 Market Share Analysis
7.2 Company Profiles (Includes Global Level Overview, Market Level Overview, Core Segments, Financials as Available, Strategic Information, Market Rank/Share, Products and Services, and Recent Developments)
7.2.1 Vertiv Group Corp.
7.2.2 Schneider Electric SE
7.2.3 STULZ GmbH
7.2.4 Huawei Digital Power Technologies Co., Ltd.
7.2.5 Johnson Controls International plc
7.2.6 Rittal GmbH & Co. KG
7.2.7 Daikin Applied (Daikin Industries, Ltd.)
7.2.8 Fujitsu General Limited
7.2.9 Mitsubishi Electric Corporation
7.2.10 Hitachi Cooling and Heating (Johnson Controls-Hitachi Air Conditioning)
7.2.11 Baltimore Aircoil Company
7.2.12 Nortek Air Solutions LLC
7.2.13 Delta Electronics, Inc.
7.2.14 Grundfos Holding A/S
7.2.15 CoolIT Systems, Inc.
7.2.16 Submer Technologies, S.L.
7.2.17 Iceotope Technologies Ltd.
7.2.18 Alfa Laval AB
7.2.19 Trane Technologies plc
7.2.20 NTT Facilities, Inc.
7.2.21 Xylem Inc.
7.2.22 Refrion S.r.l.
7.2.23 Green Revolution Cooling, Inc.
7.2.24 Munters AB

8 MARKET OPPORTUNITIES AND FUTURE OUTLOOK
8.1 White-Space and Unmet-Need Assessment

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