データセンター向けダイレクトチップ冷却市場規模、シェア、動向、2032年までの世界予測

データセンター向けダイレクトチップ冷却市場は2026年中に33億3,000万米ドル規模となり、予測期間中に年平均成長率（CAGR）26.5%で成長し、2032年には173億1,000万米ドルに達するとMarketsandMarketsでは予測しています。

MarketsandMarkets（マーケッツアンドマーケッツ）「データセンター向けダイレクトチップ冷却市場 – タイプ（単相、二相）、冷却剤タイプ（水グリコール系冷却剤、誘電性流体、冷媒）、エンドユーザー（ハイパースケールデータセンター、コロケーションプロバイダー、企業）、および地域別 – 2032年までの世界予測 – Data Center Direct-to-chip Cooling Market by Type (Single Phase, Two Phase), Coolant Type (Water-Glycol-based Coolants, Dielectric Fluids, Refrigerants), End User (Hyperscale Data Centers, Colocation Providers, Enterprises), and Region – Global Forecast to 2032」はデータセンタ用ダイレクトチップ冷却（ダイレクト・ツー・チップ冷却）の世界市場を調査し、主要セグメント別に分析・予測を行っています。

調査対象セグメント

• 冷却剤タイプ別データセンター向けダイレクトチップ冷却市場
  • 水グリコール系冷却剤
  • 誘電性流体
  • 冷媒
• タイプ別データセンター向けダイレクトチップ冷却市場
  • 単相式ダイレクトチップ冷却
  • 二相式ダイレクトチップ冷却
• エンドユーザ別データセンター向けダイレクトチップ冷却市場
  • ハイパースケールデータセンター
  • コロケーションプロバイダー
  • 企業
• 地域別データセンター向けダイレクトチップ冷却市場
  • 北米
    • 米国
    • カナダ
    • メキシコ
  • アジア太平洋地域
    • 中国
    • 日本
    • インド
    • 韓国
    • マレーシア
    • シンガポール
    • オーストラリア
    • その他のアジア太平洋地域
  • 欧州
    • ドイツ
    • フランス
    • 英国
    • その他の欧州
  • 中東＆アフリカ
    • GCC諸国
      • サウジアラビア
      • その他のGCC諸国
    • 南アフリカ
    • その他の中東＆アフリカ
  • 南米
    • ブラジル
    • その他の南米

調査対象企業

• Vertiv Group Corp. (米国)
• Super Micro Computer, Inc. (米国)
• Modine Manufacturing Company (米国)
• DCX Liquid Cooling Systems (ポーランド)
• Schneider Electric (フランス)

世界のデータセンター向けダイレクトチップ冷却市場は、高度なコンピューティングシステムにおける熱精度とコンポーネントレベルの熱管理に対するニーズの高まりによっても牽引されています。最新のプロセッサはコンパクトな設計で処理能力が向上しているため、特定の箇所で発熱が発生し、従来の部屋サイズまたはラックサイズの冷却システムでは一定の温度制御が困難になっています。ダイレクトチップ冷却は、発熱するコンポーネントに直接冷却液を供給することでこの課題を解決し、温度制御を向上させると同時に、パフォーマンスとハードウェアの寿命に悪影響を与える熱ホットスポットを低減します。データセンター事業者は、事業運営上、ダウンタイムを最小限に抑え、継続的なサービスを維持する必要があるため、信頼性の高い温度制御を提供する高度な冷却システムを採用しています。エッジコンピューティングとレイテンシに敏感なアプリケーションの拡大は、需要をさらに押し上げています。小規模で分散型のデータセンターでは、限られたスペースとインフラの制約内で動作可能な効率的な冷却ソリューションが求められているからです。これら2つの要因に加え、より高い処理効率とシステム信頼性に対する現在のニーズが相まって、世界中のデータセンターがチップ直結型冷却ソリューションの導入を進めています。

調査概要：

本レポートは、データセンター向けダイレクトチップ冷却市場を、タイプ別、冷却剤タイプ別、エンドユーザー別、地域別に定義、セグメント化し、市場規模を予測します。主要プレーヤーを戦略的にプロファイリングし、市場シェアとコアコンピタンスを包括的に分析します。また、市場における各社の事業拡大、提携、買収といった競争動向も追跡・分析します。

本レポートを購入する理由：

本レポートは、データセンター向けダイレクトチップ冷却市場とそのセグメントにおける収益予測を最も正確に提供することで、市場リーダーや新規参入企業を支援します。また、ステークホルダーが市場の競争環境をより深く理解し、事業上の地位を強化するための貴重な洞察を得て、効果的な市場参入戦略を策定するのに役立ちます。さらに、市場の動向を把握し、主要な市場推進要因、阻害要因、課題、機会に関する情報を提供します。

本レポートでは、以下のポイントについて考察します。

データセンター向けダイレクトチップ冷却市場の成長に影響を与える重要な推進要因（AIおよびHPCワークロードによる発熱密度の増加、空冷方式と比較した優れた熱効率、エネルギー効率の高いデータセンターへの需要の高まり、ハイパースケールデータセンターにおけるラック電力密度の増加）、阻害要因（高額な初期投資、既存インフラとの複雑な統合、ベンダー間の標準化の限界）、機会（AI、生成AI、GPUベースコンピューティングの急速な成長、高密度コンピューティングを備えたエッジデータセンターの拡張、廃熱回収システムとの統合）、および課題（設置・保守におけるスキルギャップ、インフラの複雑性とスペースの制約、信頼性と長期保守に関する懸念）の分析

• 製品開発／イノベーション：データセンター向けダイレクトチップ冷却市場における今後の技術、研究開発活動に関する詳細な考察
• 市場開発：包括的な情報収益性の高い市場 – 本レポートは、さまざまな地域におけるデータセンター向けダイレクトチップ冷却市場を分析します。
• 市場の多様化：データセンター向けダイレクトチップ冷却市場における新製品、各種タイプ、未開拓地域、最新動向、投資に関する包括的な情報を提供します。
• 競合分析：Vertiv Group Corp.（米国）、Super Micro Computer, Inc.（米国）、Modine Manufacturing Company（米国）、DCX Liquid Cooling Systems（ポーランド）、Schneider Electric（フランス）など、データセンター向けダイレクトチップ冷却市場の主要プレーヤーの市場シェア、成長戦略、製品ラインナップを詳細に分析します。

Report Description

The data center direct-to-chip cooling market is projected to grow from USD 3.33 billion in 2026 to USD 17.31 billion by 2032, at a CAGR of 26.5% over the forecast period. The global data center direct-to-chip cooling market is also being driven by the increasing need for thermal precision and component-level heat management in advanced computing systems. The compact design of modern processors, together with their increased processing power, results in heat generation at specific points, which prevents traditional room-sized or rack-sized cooling systems from achieving constant temperature control. Direct-to-chip cooling addresses this challenge by delivering coolant directly to heat-generating components, allowing for better temperature control while reducing thermal hotspots that adversely affect performance and hardware lifespan. Data center operators are adopting advanced cooling systems that provide dependable temperature control because their business operations require them to minimize downtime and maintain continuous service. The expansion of edge computing and latency-sensitive applications is further contributing to demand, as smaller and distributed data centers require efficient cooling solutions that can operate within limited space and infrastructure constraints. The combination of these two factors, together with the current need for higher processing efficiency and system reliability, is driving data centers worldwide to implement direct-to-chip cooling solutions.

“By type, the single phase segment is estimated to hold the largest share, in terms of value.”

The data center direct-to-chip cooling market will see its largest share from single-phase systems because they have become widely used, proven reliable, and work well with current data center systems. Single-phase cooling systems are currently the most commercially mature and widely deployed solutions, making them the preferred choice for both hyperscale operators and enterprise data centers transitioning toward liquid cooling. The adoption rate of these products has increased because their design enables simpler installation and easier maintenance, and their components do not require phase changes to function. The systems permit operators to scale their deployments because they can be integrated into existing server architectures and facility designs without major design changes. Their market dominance is further strengthened by standardized components, existing supply chains, and data center engineers who have experience with these products. Single-phase systems now provide computing power, except that they only use basic operational needs, while their single-phase systems provide the basic operational requirements that data centers need to operate their systems.

“By coolant type, the water-glycol-based coolants segment is estimated to hold the largest share, in terms of value.”

The water glycol-based coolants segment is estimated to hold the largest share, in terms of value, in the data center direct-to-chip cooling market due to its widespread industry acceptance, cost-effectiveness, and strong operational reliability across diverse data center environments. The existing use of these coolants in traditional liquid cooling and HVAC systems establishes them as a safe option that operators can trust when they switch to direct-to-chip cooling, leading to rapid adoption in operations. Water glycol mixtures deliver optimal thermal conductivity together with system protection, resulting in benefits that include corrosion resistance, freeze protection, and performance stability across different operating conditions. This makes them suitable for large data center deployments that require both stable operations and dependable performance over extended periods. The product’s handling simplicity, existing supply chain networks, and compatibility with current system infrastructure all contribute to reduced implementation challenges, which lower total expenses and enhance their market leadership position. Data centers that need expandable cooling systems that have already proven their effectiveness will encourage operators to select coolant solutions that deliver both performance benefits and operational knowledge, resulting in water glycol coolants maintaining their position as the market leader during the forecast period.

“By end user, the hyperscale segment is estimated to hold the largest share, in terms of value.”

The hyperscale segment is estimated to hold the largest share, in terms of value, in the data center direct to chip cooling market due to the massive scale of investments and the continuous expansion of large cloud and technology companies operating globally. Hyperscale data center operators deploy thousands of high-performance servers within a single facility, producing extreme heat levels that require advanced direct to chip cooling systems for efficient heat management. These operators are at the forefront of adopting liquid cooling technologies as they prioritize performance optimization, energy efficiency, and long-term cost savings at scale. Hyperscale companies possess sufficient financial resources to make substantial investments in next-generation cooling systems, which they will implement in their upcoming facilities instead of utilizing gradual system enhancements. The growing need for cloud computing, artificial intelligence, machine learning, and data-intensive applications has resulted in the expansion of hyperscale facilities, which drives up requirements for premium cooling systems. Hyperscale operators are implementing more efficient cooling technologies to lower energy consumption and enhance their sustainability performance, making direct to chip solutions beneficial. The hyperscale segment reaches its highest market value during the forecast period because it combines extensive system deployments with significant financial investments and the use of cutting-edge technologies.

Break-up of primary participants for the report:

• By Company Type: Tier 1 – 20%, Tier 2 – 40%, and Tier 3 – 40%
• By Designation: C-Level Executives– 10%, Directors– 70%, and Others – 20%
• By Region: North America – 45%, Asia Pacific – 25%, Europe – 20%, Middle East & Africa – 5%, and South America – 5%

Vertiv Group Corp. (US), Super Micro Computer, Inc. (US), Modine Manufacturing Company (US), DCX Liquid Cooling Systems (Poland), and Schneider Electric (France) are the key players in the data center direct-to-chip cooling market. These players have adopted various strategies, including agreements, joint ventures, and expansions, to increase their market share and business revenue.

Research Coverage:

The report defines, segments, and projects the size of the data center direct-to-chip cooling market by type, coolant type, end user, and region. It strategically profiles the key players and comprehensively analyzes their market share and core competencies. It also tracks and analyzes competitive developments, such as expansions, agreements, and acquisitions undertaken by them in the market.

Reasons to Buy the Report:

The report is expected to help market leaders/new entrants by providing the closest approximations of revenue for the data center direct-to-chip cooling market and its segments. This report is also expected to help stakeholders gain a deeper understanding of the market’s competitive landscape, acquire valuable insights to enhance their business positions, and develop effective go-to-market strategies. It also enables stakeholders to understand the market’s pulse and provides information on key market drivers, restraints, challenges, and opportunities.

The report provides insights into the following pointers:

• Analysis of critical drivers (Increasing Heat Density from AI & HPC Workloads, Superior Thermal Efficiency Compared to Air Cooling, Growing Demand for Energy-efficient Data Centers, Increasing Rack Power Density in Hyperscale Data Centers), restraints (High Initial Capital Investment, Complex Integration with Existing Infrastructure, Limited Standardization Across Vendors), opportunities (Rapid Growth of AI, Generative AI, and GPU-based Computing, Expansion of Edge Data Centers with High Compute Density, Integration with Waste Heat Recovery Systems), and challenges (Skill Gap in Installation and Maintenance, Infrastructure Complexity and Space Constraints, Reliability and Long-term Maintenance Concerns) influencing the growth of the data center direct-to-chip cooling market
• Product Development/Innovation: Detailed insights on upcoming technologies, research & development activities in the data center direct-to-chip cooling market
• Market Development: Comprehensive information about lucrative markets – the report analyzes the data center direct-to-chip cooling market across varied regions
• Market Diversification: Exhaustive information about new products, various types, untapped geographies, recent developments, and investments in the data center direct-to-chip cooling market.
• Competitive Assessment: In-depth assessment of market shares, growth strategies, and product offerings of leading players such as Vertiv Group Corp. (US), Super Micro Computer, Inc. (US), Modine Manufacturing Company (US), DCX Liquid Cooling Systems (Poland), Schneider Electric (France), and others are the key players in the data center direct-to-chip cooling market.

Table of Contents

1 INTRODUCTION 24
1.1 STUDY OBJECTIVES 24
1.2 MARKET DEFINITION 24

1.3 STUDY SCOPE 25
1.3.1 MARKETS COVERED AND REGIONAL SCOPE 25
1.3.2 INCLUSIONS AND EXCLUSIONS 25
1.3.3 YEARS CONSIDERED 26
1.4 CURRENCY CONSIDERED 26
1.5 UNIT CONSIDERED 26
1.6 LIMITATIONS 26
1.7 STAKEHOLDERS 26

2 EXECUTIVE SUMMARY 28

2.1 KEY INSIGHTS AND MARKET HIGHLIGHTS 28
2.2 KEY MARKET PARTICIPANTS: SHARE INSIGHTS AND STRATEGIC DEVELOPMENTS 29
2.3 DISRUPTIVE TRENDS IN DATA CENTER DIRECT-TO-CHIP COOLING MARKET 30
2.4 HIGH-GROWTH SEGMENTS 30
2.5 REGIONAL SNAPSHOT: MARKET SIZE, GROWTH RATE, AND FORECAST 31

3 PREMIUM INSIGHTS 32

3.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN DATA CENTER DIRECT-TO-
CHIP COOLING MARKET 32
3.2 DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY END USER 32
3.3 DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE 33
3.4 DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY REGION 33
3.5 DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY COUNTRY 34

4 MARKET OVERVIEW 35

4.1 INTRODUCTION 35
4.2 MARKET DYNAMICS 35
4.2.1 DRIVERS 36
4.2.1.1 Rising AI, HPC, and hyperscale workloads 36
4.2.1.2 Increasing rack power density 37
4.2.1.3 Energy efficiency and sustainability goals 38
4.2.2 RESTRAINTS 39
4.2.2.1 High initial capital investment 39
4.2.2.2 Integration complexity in existing data centers 39
4.2.2.3 Lack of standardization 40

4.2.3 OPPORTUNITIES 40
4.2.3.1 Expansion of edge and modular data centers 40
4.2.3.2 Innovation in coolant technologies and microfluidics 41
4.2.3.3 High-density computing and chip innovation 42
4.2.4 CHALLENGES 42
4.2.4.1 Leakage and reliability risks 42
4.2.4.2 Cooling of non-chip components 43
4.3 UNMET NEEDS AND WHITE SPACES 43
4.3.1 UNMET NEEDS IN DATA CENTER DIRECT-TO-CHIP COOLING MARKET 43
4.3.2 WHITE SPACE OPPORTUNITIES 44
4.4 INTERCONNECTED MARKETS AND CROSS-SECTOR OPPORTUNITIES 45
4.4.1 INTERCONNECTED MARKETS 45
4.4.2 CROSS SECTOR OPPORTUNITIES 45
4.5 EMERGING BUSINESS MODELS AND ECOSYSTEM SHIFTS 46
4.5.1 EMERGING BUSINESS MODELS 46
4.5.2 ECOSYSTEM SHIFTS 47
4.6 STRATEGIC MOVES BY TIER 1/2/3 PLAYERS 48
4.6.1 KEY MOVES AND STRATEGIC FOCUS 48

5 INDUSTRY TRENDS 49

5.1 PORTER’S FIVE FORCES ANALYSIS 49
5.1.1 THREAT OF NEW ENTRANTS 50
5.1.2 THREAT OF SUBSTITUTES 51
5.1.3 BARGAINING POWER OF SUPPLIERS 51
5.1.4 BARGAINING POWER OF BUYERS 52
5.1.5 INTENSITY OF COMPETITIVE RIVALRY 52
5.2 MACROECONOMICS INDICATORS 53
5.2.1 INTRODUCTION 53
5.2.2 GDP TRENDS AND FORECAST 53
5.2.3 DATA CENTER INDUSTRY 55
5.2.4 TRENDS IN GLOBAL DATA CENTER COOLING INDUSTRY 55
5.2.5 MANUFACTURING INDUSTRY 55
5.2.6 TRENDS IN GLOBAL HYPERSCALE AND AI DATA CENTER INDUSTRY 56
5.3 VALUE CHAIN ANALYSIS 56
5.4 ECOSYSTEM ANALYSIS 58
5.5 ENERGY SUSTAINABILITY FOR DATA CENTERS 59
5.5.1 SUSTAINABLE DATA CENTERS USING DIRECT-TO-CHIP COOLING 59
5.5.2 ISSUES IN DEVELOPING COUNTRIES 60
5.6 KEY CONFERENCES AND EVENTS, 2026–2027 60
5.7 TRENDS AND DISRUPTIONS IMPACTING CUSTOMER BUSINESS 61
5.8 INVESTMENT AND FUNDING SCENARIO 61

5.9 CASE STUDY ANALYSIS 62
5.9.1 CASE STUDY 1: PERFORMANCE EVALUATION OF TWO-PHASE DIRECT-TO-CHIP LIQUID COOLING COMBINED WITH AIR COOLING FOR DATA CENTERS 62
5.9.2 CASE STUDY 2: A PATH TO COMMISSIONING OF DIRECT-TO-CHIP LIQUID COOLING FOR HYPERSCALE DATA CENTERS USING EXPERIMENTAL AND CFD TECHNIQUES 63

6 KEY TECHNOLOGICAL ADVANCEMENTS, AI-DRIVEN IMPACT, AND FUTURE APPLICATIONS 64

6.1 KEY EMERGING TECHNOLOGIES 64
6.1.1 TWO-PHASE DIRECT-TO-CHIP COOLING 64
6.1.2 ADVANCED COLD PLATE DESIGN 64
6.2 ADJACENT TECHNOLOGIES 65
6.2.1 MICROCHANNEL LIQUID COOLING 65
6.2.2 MICROCONVECTIVE LIQUID COOLING 65
6.3 FUTURE APPLICATIONS 65
6.3.1 AI-OPTIMIZED HYPERSCALE DATA CENTERS 66
6.3.2 EDGE & DISTRIBUTED DATA CENTERS 66
6.3.3 HYBRID COOLING IN EXISTING DATA CENTERS 67
6.3.4 HIGH-PERFORMANCE COMPUTING (HPC) & AI CLUSTERS 68
6.3.5 SUSTAINABLE & ENERGY-EFFICIENT DATA CENTERS 68
6.4 IMPACT OF AI/GEN AI ON DATA CENTER DIRECT-TO-CHIP COOLING MARKET 69
6.4.1 TOP USE CASES AND MARKET POTENTIAL 70
6.4.2 BEST MARKET PRACTICES 70
6.4.3 CASE STUDIES OF AI IMPLEMENTATION IN DATA CENTER DIRECT-TO-CHIP COOLING MARKET 71
6.4.4 READINESS OF COMPANIES TO ADOPT GENERATIVE AI IN DATA CENTER DIRECT-TO-CHIP COOLING MARKET 71
6.5 SUCCESS STORIES AND REAL-WORLD APPLICATIONS 71
6.5.1 VERTIV: AI-READY LIQUID COOLING INFRASTRUCTURE DEPLOYMENT 72
6.5.2 SCHNEIDER ELECTRIC: END-TO-END LIQUID COOLING ECOSYSTEM 72
6.5.3 COMPUDYNAMICS: COMPLEX LIQUID COOLING FOR HIGH DENSITY RACKS AT A HYPERSCALE DATA CENTER IN NC 72

7 SUSTAINABILITY AND REGULATORY LANDSCAPE 73

7.1 REGIONAL REGULATIONS AND COMPLIANCE 73
7.1.1 REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 73
7.1.2 US 75
7.1.3 EUROPE 76
7.1.4 CHINA 76
7.1.5 JAPAN 77

7.1.6 INDIA 77
7.1.7 SINGAPORE 78
7.1.8 OPEN COMPUTE PROJECT (OCP): A STANDARD FOR DATA CENTER BUILDINGS 79
7.2 SUSTAINABILITY INITIATIVES 79
7.2.1 CARBON IMPACT AND ECO APPLICATIONS OF PROPYLENE OXIDE 79
7.3 SUSTAINABILITY IMPACT AND REGULATORY POLICY INITIATIVES 80
7.4 CERTIFICATIONS, LABELING, AND ECO STANDARDS 82

8 CUSTOMER LANDSCAPE & BUYER BEHAVIOR 84

8.1 DECISION-MAKING PROCESS 84
8.2 KEY STAKEHOLDERS AND BUYING CRITERIA 87
8.2.1 KEY STAKEHOLDERS IN BUYING PROCESS 87
8.2.2 BUYING CRITERIA 88
8.3 ADOPTION BARRIERS & INTERNAL CHALLENGES 89
8.4 UNMET NEEDS IN VARIOUS END-USE INDUSTRIES 91
8.5 MARKET PROFITABILITY 91
8.5.1 REVENUE POTENTIAL 92
8.5.2 COST DYNAMICS 92
8.5.3 MARGIN OPPORTUNITIES IN KEY APPLICATIONS 92

9 DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY COOLANT TYPE 94

9.1 INTRODUCTION 94
9.2 WATER-GLYCOL-BASED COOLANTS 94
9.2.1 INCREASING DEMAND FOR SCALABLE AND EASY-TO-MAINTAIN COOLING SOLUTIONS TO INCREASE DEMAND 94
9.3 DIELECTRIC FLUID 95
9.3.1 RISING NEED FOR SAFE AND HIGH-PERFORMANCE COOLING IN ADVANCED DATA CENTERS TO BOOST MARKET 95
9.4 REFRIGERANTS 95
9.4.1 GROWING FOCUS ON ADVANCED COOLING TECHNOLOGIES FOR HIGH-DENSITY WORKLOADS TO INCREASE DEMAND 95

10 DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE 96

10.1 INTRODUCTION 97
10.2 SINGLE-PHASE 98
10.2.1 GROWING PREFERENCE FOR SIMPLER AND COST-EFFECTIVE LIQUID COOLING SOLUTIONS TO BOOST MARKET GROWTH 98
10.3 TWO-PHASE 99
10.3.1 RISING NEED FOR HIGH-EFFICIENCY COOLING IN HIGH-DENSITY COMPUTING ENVIRONMENTS TO SUPPORT MARKET EXPANSION 99

11 DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY END USER 101

11.1 INTRODUCTION 102
11.2 HYPERSCALE DATA CENTERS 103
11.2.1 RAPID EXPANSION OF LARGE-SCALE CLOUD INFRASTRUCTURE AND HIGH-DENSITY COMPUTING TO FUEL MARKET GROWTH 103
11.3 COLOCATION PROVIDERS 104
11.3.1 RISING DEMAND FOR SCALABLE AND HIGH-PERFORMANCE SHARED DATA CENTER FACILITIES TO SUPPORT MARKET GROWTH 104
11.4 ENTERPRISES 105
11.4.1 INCREASING DIGITAL TRANSFORMATION AND ADOPTION OF HIGH-PERFORMANCE IT INFRASTRUCTURE TO INCREASE DEMAND 105

12 DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY REGION 107

12.1 INTRODUCTION 108
12.2 NORTH AMERICA 109
12.3 US 112
12.3.1 RAPID AI INFRASTRUCTURE EXPANSION TO SUPPORT MARKET GROWTH 112
12.4 CANADA 113
12.4.1 SUSTAINABLE DATA CENTER DEVELOPMENT AND COLD CLIMATE ADVANTAGE DRIVING LIQUID COOLING ADOPTION 113
12.5 MEXICO 114
12.5.1 RISING HYPERSCALE INVESTMENTS AND WATER-EFFICIENT COOLING REQUIREMENTS TO BOOST MARKET 114
12.6 ASIA PACIFIC 115
12.7 CHINA 118
12.7.1 RAPID AI INFRASTRUCTURE EXPANSION AND DOMESTIC SEMICONDUCTOR ECOSYSTEM INTEGRATION TO DRIVE MARKET 118
12.8 JAPAN 120
12.8.1 HIGH DENSITY URBAN DATA CENTER DEPLOYMENTS AND ENERGY EFFICIENCY MANDATES TO DRIVE DEMAND 120
12.9 INDIA 121
12.9.1 EXTREME CLIMATIC CONDITIONS AND LARGE-SCALE HYPERSCALE INVESTMENTS TO INCREASE DEMAND 121
12.10 SOUTH KOREA 123
12.10.1 HYPERSCALE AI DATA CENTER INVESTMENTS AND SEMICONDUCTOR-DRIVEN COMPUTE INTENSITY TO SUPPORT MARKET GROWTH 123
12.11 MALAYSIA 124
12.11.1 RISING HYPERSCALE INVESTMENTS AND TROPICAL CLIMATE-DRIVEN COOLING REQUIREMENTS TO BOOST MARKET 124
12.12 SINGAPORE 125
12.12.1 HYPERSCALE EXPANSION AND STRONG SUSTAINABILITY MANDATES TO FUEL ADOPTION 125
12.13 AUSTRALIA 126
12.13.1 STRONG AI INFRASTRUCTURE GROWTH AND STRICT SUSTAINABILITY REGULATIONS TO SUPPORT MARKET GROWTH 126
12.14 REST OF ASIA PACIFIC 128
12.15 EUROPE 129
12.16 GERMANY 132
12.16.1 STRINGENT ENERGY EFFICIENCY REGULATIONS AND WASTE HEAT REUSE MANDATES DRIVING ADVANCED COOLING ADOPTION 132
12.17 FRANCE 133
12.17.1 STRONG HYPERSCALE INVESTMENTS AND SUSTAINABILITY-DRIVEN DATA CENTER EXPANSION TO BOOST MARKET EXPANSION 133
12.18 UK 134
12.18.1 AI INFRASTRUCTURE DEVELOPMENT AND GOVERNMENT SUPPORT FOR ENERGY-EFFICIENT DATA CENTERS TO INCREASE ADOPTION 134
12.19 REST OF EUROPE 136
12.20 MIDDLE EAST & AFRICA 137
12.20.1 GCC COUNTRIES 139
12.21 SAUDI ARABIA 140
12.21.1 AI INFRASTRUCTURE INVESTMENTS AND EXTREME CLIMATE DRIVING ADOPTION OF ADVANCED COOLING TECHNOLOGIES 140
12.22 REST OF GCC COUNTRIES 141
12.22.1 GROWING DIGITAL INFRASTRUCTURE DEVELOPMENT AND RISING NEED FOR ENERGY-EFFICIENT COOLING TO BOOST MARKET 141
12.23 SOUTH AFRICA 143
12.23.1 RISING HYPERSCALE INVESTMENTS, AI INFRASTRUCTURE EXPANSION, AND FOCUS ON ENERGY AND WATER-EFFICIENT COOLING TO BOOST MARKET 143
12.24 REST OF MIDDLE EAST & AFRICA 144
12.25 SOUTH AMERICA 145
12.26 BRAZIL 147
12.26.1 LARGE-SCALE HYPERSCALE INVESTMENTS AND RENEWABLE ENERGY-DRIVEN DATA CENTER EXPANSION TO BOOST MARKET 147
12.27 REST OF SOUTH AMERICA 148

13 COMPETITIVE LANDSCAPE 150

13.1 INTRODUCTION 150
13.2 KEY PLAYERS’ STRATEGIES/RIGHT TO WIN 150
13.3 REVENUE ANALYSIS 152
13.4 MARKET SHARE ANALYSIS, 2025 153
13.4.1 RANKING OF KEY MARKET PLAYERS, 2025 153
13.4.2 MARKET SHARE ANALYSIS, 2025 153
13.4.2.1 Vertiv Group Corp. (US) 154
13.4.2.2 Super Micro Computer, Inc. (US) 154
13.4.2.3 Modine Manufacturing Company (US) 155
13.4.2.4 DCX Liquid Cooling Systems (Poland) 155
13.4.2.5 Schneider Electric (France) 155

13.5 BRAND/PRODUCT COMPARISON 156
13.5.1 VERTIV 156
13.5.2 SUPERMICRO 156
13.5.3 MODINE 157
13.5.4 DCX 157
13.5.5 SCHNEIDER ELECTRIC 157
13.6 COMPANY VALUATION AND FINANCIAL METRICS 157
13.7 COMPANY EVALUATION MATRIX: KEY PLAYERS, 2025 159
13.7.1 STARS 159
13.7.2 EMERGING LEADERS 159
13.7.3 PERVASIVE PLAYERS 160
13.7.4 PARTICIPANTS 160
13.7.5 COMPANY FOOTPRINT: KEY PLAYERS, 2025 161
13.7.5.1 Company footprint 161
13.7.6 REGION FOOTPRINT 162
13.7.7 TYPE FOOTPRINT 163
13.7.8 COOLANT TYPE FOOTPRINT 164
13.7.9 END USER FOOTPRINT 165
13.8 COMPANY EVALUATION MATRIX: STARTUPS/SMES, 2024 166
13.8.1 PROGRESSIVE COMPANIES 166
13.8.2 RESPONSIVE COMPANIES 166
13.8.3 DYNAMIC COMPANIES 166
13.8.4 STARTING BLOCKS 166
13.8.5 COMPETITIVE BENCHMARKING: STARTUPS/SMES, 2025 168
13.8.5.1 Detailed list of key startups/SMEs 168
13.8.5.2 Competitive benchmarking of key startups/SMEs 168
13.9 COMPETITIVE SCENARIO 169
13.9.1 PRODUCT LAUNCHES 169
13.9.2 DEALS 170
13.9.3 EXPANSIONS 171

14 COMPANY PROFILES 173

14.1 MAJOR PLAYERS 173
14.1.1 VERTIV GROUP CORP. 173
14.1.1.1 Business overview 173
14.1.1.2 Products offered 174
14.1.1.3 Recent developments 175
14.1.1.3.1 Product launches 175
14.1.1.3.2 Deals 176
14.1.1.3.3 Expansions 177

14.1.1.4 MnM view 178
14.1.1.4.1 Key strengths 178
14.1.1.4.2 Strategic choices 178
14.1.1.4.3 Weaknesses and competitive threats 178
14.1.2 SUPER MICRO COMPUTER, INC. 179
14.1.2.1 Business overview 179
14.1.2.2 Products offered 180
14.1.2.3 Recent developments 181
14.1.2.3.1 Deals 181
14.1.2.3.2 Expansions 181
14.1.2.4 MnM view 182
14.1.2.4.1 Key strengths 182
14.1.2.4.2 Strategic choices 182
14.1.2.4.3 Weaknesses and competitive threats 183
14.1.3 MODINE MANUFACTURING COMPANY 184
14.1.3.1 Business overview 184
14.1.3.2 Products offered 185
14.1.3.3 Recent developments 186
14.1.3.3.1 Product launches 186
14.1.3.3.2 Deals 186
14.1.3.3.3 Expansions 187
14.1.4 DCX LIQUID COOLING SYSTEMS 188
14.1.4.1 Business overview 188
14.1.4.2 Products offered 188
14.1.4.3 Recent developments 189
14.1.4.3.1 Product launches 189
14.1.4.4 MnM view 189
14.1.4.4.1 Key strengths 189
14.1.4.4.2 Strategic choices 190
14.1.4.4.3 Weaknesses and competitive threats 190
14.1.5 SCHNEIDER ELECTRIC 191
14.1.5.1 Business overview 191
14.1.5.2 Products offered 192
14.1.5.3 Recent developments 193
14.1.5.3.1 Deals 193
14.1.5.3.2 Expansions 194
14.1.5.4 MnM view 194
14.1.5.4.1 Key strengths 194
14.1.5.4.2 Strategic choices 195
14.1.5.4.3 Weaknesses and competitive threats 195

14.1.6 FLEX LTD. 196
14.1.6.1 Business overview 196
14.1.6.2 Products offered 197
14.1.6.3 Recent developments 198
14.1.6.3.1 Deals 198
14.1.7 COOLIT SYSTEMS 199
14.1.7.1 Business overview 199
14.1.7.2 Products offered 199
14.1.7.3 Recent developments 200
14.1.7.3.1 Product launches 200
14.1.7.3.2 Deals 201
14.1.7.3.3 Expansions 202
14.1.8 NVENT 203
14.1.8.1 Business overview 203
14.1.8.2 Products offered 204
14.1.8.3 Recent developments 205
14.1.8.3.1 Deals 205
14.1.8.3.2 Expansions 205
14.1.9 KAORI HEAT TREATMENT CO., LTD. 206
14.1.9.1 Business overview 206
14.1.9.2 Products offered 207
14.1.10 ZUTACORE, INC. 208
14.1.10.1 Business overview 208
14.1.10.2 Products offered 208
14.1.10.3 Recent developments 208
14.1.10.3.1 Product launches 208
14.1.10.3.2 Deals 209
14.1.11 ICEOTOPE PRECISION LIQUID COOLING 211
14.1.11.1 Business overview 211
14.1.11.2 Products offered 211
14.1.11.3 Recent developments 212
14.1.11.3.1 Product launches 212
14.1.11.3.2 Deals 213
14.1.11.3.3 Expansions 214
14.1.12 BOYD 215
14.1.12.1 Business overview 215
14.1.12.2 Products offered 215
14.1.13 TAISOL ELECTRONICS CO., LTD. 216
14.1.13.1 Business overview 216
14.1.13.2 Products offered 217
14.1.14 WIWYNN CORPORATION 218
14.1.14.1 Business overview 218
14.1.14.2 Products offered 218
14.1.15 INSPUR CO., LTD. 219
14.1.15.1 Business overview 219
14.1.15.2 Products offered 220
14.1.16 LENOVO 221
14.1.16.1 Business overview 221
14.1.16.2 Products offered 222
14.1.16.3 Recent developments 224
14.1.16.3.1 Product launches 224
14.1.16.3.2 Deals 225
14.1.17 ACCELSIUS LLC 226
14.1.17.1 Business overview 226
14.1.17.2 Recent developments 227
14.1.17.2.1 Product launches 227
14.1.18 STULZ GMBH 228
14.1.18.1 Business overview 228
14.1.18.2 Products offered 228
14.1.18.3 Recent developments 229
14.1.18.3.1 Product launches 229
14.1.19 RITTAL GMBH & CO. KG (FRIEDHELM LOH GROUP) 230
14.1.19.1 Business overview 230
14.1.19.2 Products offered 230
14.1.19.3 Recent developments 231
14.1.19.3.1 Product launches 231
14.1.19.3.2 Deals 231
14.1.20 DELTA POWER SOLUTIONS 232
14.1.20.1 Business overview 232
14.1.20.2 Products offered 233
14.1.20.3 Recent developments 233
14.1.20.3.1 Deals 233
14.1.21 LIQUIDSTACK HOLDING B.V. (TRANE TECHNOLOGIES) 234
14.1.21.1 Business overview 234
14.1.21.2 Products/Solutions/Services offered 234
14.1.21.3 Recent developments 235
14.1.21.3.1 Product launches 235
14.1.21.3.2 Deals 235
14.1.21.3.3 Expansions 236
14.1.21.3.4 Other developments 236
14.1.22 CHILLDYNE, INC. 237
14.1.22.1 Business overview 237
14.1.22.2 Products/Solutions/Services offered 237
14.1.22.3 Recent developments 238
14.1.22.3.1 Product launches 238
14.1.22.3.2 Deals 239
14.1.23 MALICO INC. 240
14.1.23.1 Business overview 240
14.1.23.2 Products/Solutions/Services offered 240
14.2 OTHER PLAYERS 241
14.2.1 KOOLANCE, INC. 241
14.2.2 GIGA-BYTE TECHNOLOGY CO., LTD. 241
14.2.3 OPTICOOL TECHNOLOGIES 242
14.2.4 SEGUENTE INC. 242
14.2.5 COOLCENTRIC 243

15 RESEARCH METHODOLOGY 244

15.1 RESEARCH DATA 244
15.1.1 SECONDARY DATA 245
15.1.1.1 List of key secondary sources 245
15.1.1.2 Key data from secondary sources 245
15.1.2 PRIMARY DATA 246
15.1.2.1 Key data from primary sources 246
15.1.2.2 Key industry insights 247
15.1.2.3 List of primary participants 247
15.1.2.4 Breakdown of primary interviews 247
15.2 MARKET SIZE ESTIMATION 248
15.2.1 BOTTOM-UP APPROACH 248
15.2.2 TOP-DOWN APPROACH 249
15.3 DEMAND-SIDE ANALYSIS 249
15.4 SUPPLY-SIDE ANALYSIS 250
15.4.1 CALCULATIONS FOR SUPPLY-SIDE ANALYSIS 250
15.5 GROWTH FORECAST 250
15.6 DATA TRIANGULATION 251
15.7 RESEARCH ASSUMPTIONS 252
15.8 RESEARCH LIMITATIONS 252
15.9 RISK ASSESSMENT 253
15.10 FACTOR ANALYSIS 253

16 APPENDIX 254

16.1 DISCUSSION GUIDE 254
16.2 KNOWLEDGESTORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL 256
16.3 CUSTOMIZATION OPTIONS 258
16.4 RELATED REPORTS 258

List of Tables

TABLE 1 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: IMPACT OF PORTER’S
FIVE FORCES 50
TABLE 2 GDP PERCENTAGE CHANGE, BY KEY COUNTRIES, 2021–2029 53
TABLE 3 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: ROLES OF COMPANIES IN ECOSYSTEM 58
TABLE 4 DATA CENTER COOLING LIQUID MARKET: LIST OF CONFERENCES AND EVENTS, 2026–2027 60
TABLE 5 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: TOP USE CASES AND MARKET POTENTIAL 70
TABLE 6 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: BEST PRACTICES 70
TABLE 7 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: CASE STUDIES OF GEN AI IMPLEMENTATION 71
TABLE 8 NORTH AMERICA: LIST OF REGULATORY BODIES, GOVERNMENT AGENCIES,
AND OTHER ORGANIZATIONS 73
TABLE 9 EUROPE: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 74
TABLE 10 ASIA PACIFIC: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 74
TABLE 11 ROW: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 75
TABLE 12 CERTIFICATIONS, LABELING, AND ECO STANDARDS IN DATA CENTER DIRECT-TO-CHIP COOLING MARKET 82
TABLE 13 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS, BY END USER (%) 87
TABLE 14 KEY BUYING CRITERIA, BY END USER 88
TABLE 15 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: UNMET NEEDS IN
KEY END-USE INDUSTRIES 91
TABLE 16 DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE,
2021–2025 (USD MILLION) 97
TABLE 17 DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE,
2026–2032 (USD MILLION) 97
TABLE 18 SINGLE-PHASE: DATA CENTER DIRECT-TO-CHIP COOLING MARKET,
BY REGION, 2021–2025 (USD MILLION) 98
TABLE 19 SINGLE-PHASE: DATA CENTER DIRECT-TO-CHIP COOLING MARKET,
BY REGION, 2026–2032 (USD MILLION) 99
TABLE 20 TWO-PHASE: DATA CENTER DIRECT-TO-CHIP COOLING MARKET,
BY REGION, 2021–2025 (USD MILLION) 100
TABLE 21 TWO-PHASE: DATA CENTER DIRECT-TO-CHIP COOLING MARKET,
BY REGION, 2026–2032 (USD MILLION) 100
TABLE 22 DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY END USER,
2021–2025 (USD MILLION) 102
TABLE 23 DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY END USER,
2026–2032 (USD MILLION) 103
TABLE 24 HYPERSCALE DATA CENTERS: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY REGION, 2021–2025 (USD MILLION) 104
TABLE 25 HYPERSCALE DATA CENTERS: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY REGION, 2026–2032 (USD MILLION) 104
TABLE 26 COLOCATION PROVIDERS: DATA CENTER DIRECT-TO-CHIP COOLING MARKET,
BY REGION, 2021–2025 (USD MILLION) 105
TABLE 27 COLOCATION PROVIDERS: DATA CENTER DIRECT-TO-CHIP COOLING MARKET,
BY REGION, 2026–2032 (USD MILLION) 105
TABLE 28 ENTERPRISES: DATA CENTER DIRECT-TO-CHIP COOLING MARKET,
BY REGION, 2021–2025 (USD MILLION) 106
TABLE 29 ENTERPRISES: DATA CENTER DIRECT-TO-CHIP COOLING MARKET,
BY REGION, 2026–2032 (USD MILLION) 106
TABLE 30 DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY REGION,
2021–2025 (USD MILLION) 109
TABLE 31 DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY REGION,
2026–2032 (USD MILLION) 109
TABLE 32 NORTH AMERICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET,
BY COUNTRY, 2021–2025 (USD MILLION) 110
TABLE 33 NORTH AMERICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET,
BY COUNTRY, 2026–2032 (USD MILLION) 110
TABLE 34 NORTH AMERICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET,
BY TYPE, 2021–2025 (USD MILLION) 111
TABLE 35 NORTH AMERICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET,
BY TYPE, 2026–2032 (USD MILLION) 111
TABLE 36 NORTH AMERICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET,
BY END USER, 2021–2025 (USD MILLION) 111
TABLE 37 NORTH AMERICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET,
BY END USER, 2026–2032 (USD MILLION) 111
TABLE 38 US: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE,
2021–2025 (USD MILLION) 112
TABLE 39 US: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE,
2026–2032 (USD MILLION) 113
TABLE 40 CANADA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE,
2021–2025 (USD MILLION) 114
TABLE 41 CANADA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE,
2026–2032 (USD MILLION) 114
TABLE 42 MEXICO: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE,
2021–2025 (USD MILLION) 115
TABLE 43 MEXICO: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE,
2026–2032 (USD MILLION) 115
TABLE 44 ASIA PACIFIC: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY COUNTRY, 2021–2025 (USD MILLION) 117
TABLE 45 ASIA PACIFIC: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY COUNTRY, 2026–2032 (USD MILLION) 117
TABLE 46 ASIA PACIFIC: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE,
2021–2025 (USD MILLION) 117
TABLE 47 ASIA PACIFIC: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE,
2026–2032 (USD MILLION) 118
TABLE 48 ASIA PACIFIC: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY END USER, 2021–2025 (USD MILLION) 118
TABLE 49 ASIA PACIFIC: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY END USER, 2026–2032 (USD MILLION) 118
TABLE 50 CHINA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE,
2021–2025 (USD MILLION) 119
TABLE 51 CHINA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE,
2026–2032 (USD MILLION) 120
TABLE 52 JAPAN: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE,
2021–2025 (USD MILLION) 121
TABLE 53 JAPAN: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE,
2026–2032 (USD MILLION) 121
TABLE 54 INDIA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE,
2021–2025 (USD MILLION) 122
TABLE 55 INDIA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE,
2026–2032 (USD MILLION) 122
TABLE 56 SOUTH KOREA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET,
BY TYPE, 2021–2025 (USD MILLION) 124
TABLE 57 SOUTH KOREA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET,
BY TYPE, 2026–2032 (USD MILLION) 124
TABLE 58 MALAYSIA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE,
2021–2025 (USD MILLION) 125
TABLE 59 MALAYSIA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE,
2026–2032 (USD MILLION) 125
TABLE 60 SINGAPORE: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE,
2021–2025 (USD MILLION) 126
TABLE 61 SINGAPORE: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE,
2026–2032 (USD MILLION) 126
TABLE 62 AUSTRALIA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE,
2021–2025 (USD MILLION) 127
TABLE 63 AUSTRALIA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE,
2026–2032 (USD MILLION) 127
TABLE 64 REST OF ASIA PACIFIC: DATA CENTER DIRECT-TO-CHIP COOLING MARKET,
BY TYPE, 2021–2025 (USD MILLION) 129
TABLE 65 REST OF ASIA PACIFIC: DATA CENTER DIRECT-TO-CHIP COOLING MARKET,
BY TYPE, 2026–2032 (USD MILLION) 129
TABLE 66 EUROPE: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY COUNTRY,
2021–2025 (USD MILLION) 130
TABLE 67 EUROPE: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY COUNTRY,
2026–2032 (USD MILLION) 131
TABLE 68 EUROPE: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE,
2021–2025 (USD MILLION) 131
TABLE 69 EUROPE: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE,
2026–2032 (USD MILLION) 131
TABLE 70 EUROPE: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY END USER,
2021–2025 (USD MILLION) 131
TABLE 71 EUROPE: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY END USER,
2026–2032 (USD MILLION) 132
TABLE 72 GERMANY: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE,
2021–2025 (USD MILLION) 133
TABLE 73 GERMANY: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE,
2026–2032 (USD MILLION) 133
TABLE 74 FRANCE: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE,
2021–2025 (USD MILLION) 134
TABLE 75 FRANCE: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE,
2026–2032 (USD MILLION) 134
TABLE 76 UK: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE,
2021–2025 (USD MILLION) 135
TABLE 77 UK: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE,
2026–2032 (USD MILLION) 135
TABLE 78 REST OF EUROPE: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2021–2025 (USD MILLION) 137
TABLE 79 REST OF EUROPE: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2026–2032 (USD MILLION) 137
TABLE 80 MIDDLE EAST & AFRICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET,
BY COUNTRY, 2021–2025 (USD MILLION) 138
TABLE 81 MIDDLE EAST & AFRICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET,
BY COUNTRY, 2026–2032 (USD MILLION) 138
TABLE 82 MIDDLE EAST & AFRICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET,
BY TYPE, 2021–2025 (USD MILLION) 138
TABLE 83 MIDDLE EAST & AFRICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET,
BY TYPE, 2026–2032 (USD MILLION) 139
TABLE 84 MIDDLE EAST & AFRICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET,
BY END USER, 2021–2025 (USD MILLION) 139
TABLE 85 MIDDLE EAST & AFRICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET,
BY END USER, 2026–2032 (USD MILLION) 139
TABLE 86 SAUDI ARABIA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE,
2021–2025 (USD MILLION) 141
TABLE 87 SAUDI ARABIA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE,
2026–2032 (USD MILLION) 141
TABLE 88 REST OF GCC COUNTRIES: DATA CENTER DIRECT-TO-CHIP COOLING MARKET,
BY TYPE, 2021–2025 (USD MILLION) 142
TABLE 89 REST OF GCC COUNTRIES: DATA CENTER DIRECT-TO-CHIP COOLING MARKET,
BY TYPE, 2026–2032 (USD MILLION) 142
TABLE 90 SOUTH AFRICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2021–2025 (USD MILLION) 143
TABLE 91 SOUTH AFRICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2026–2032 (USD MILLION) 144
TABLE 92 REST OF MIDDLE EAST & AFRICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2021–2025 (USD MILLION) 145
TABLE 93 REST OF MIDDLE EAST & AFRICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE, 2026–2032 (USD MILLION) 145
TABLE 94 SOUTH AMERICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET,
BY COUNTRY, 2021–2025 (USD MILLION) 146
TABLE 95 SOUTH AMERICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET,
BY COUNTRY, 2026–2032 (USD MILLION) 146
TABLE 96 SOUTH AMERICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET,
BY TYPE, 2021–2025 (USD MILLION) 146
TABLE 97 SOUTH AMERICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET,
BY TYPE, 2026–2032 (USD MILLION) 146
TABLE 98 SOUTH AMERICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET,
BY END USER, 2021–2025 (USD MILLION) 147
TABLE 99 SOUTH AMERICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET,
BY END USER, 2026–2032 (USD MILLION) 147
TABLE 100 BRAZIL: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE,
2021–2025 (USD MILLION) 148
TABLE 101 BRAZIL: DATA CENTER DIRECT-TO-CHIP COOLING MARKET, BY TYPE,
2026–2032 (USD MILLION) 148
TABLE 102 REST OF SOUTH AMERICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET,
BY TYPE, 2021–2025 (USD MILLION) 149
TABLE 103 REST OF SOUTH AMERICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET,
BY TYPE, 2026–2032 (USD MILLION) 149
TABLE 104 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: OVERVIEW OF STRATEGIES ADOPTED BY KEY PLAYERS, 2021–2026 150
TABLE 105 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: DEGREE OF
COMPETITION, 2025 154
TABLE 106 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: REGION FOOTPRINT 162
TABLE 107 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: TYPE FOOTPRINT 163
TABLE 108 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: COOLANT TYPE FOOTPRINT 164
TABLE 109 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: END USER FOOTPRINT 165
TABLE 110 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: DETAILED LIST
OF KEY STARTUPS/SMES 168
TABLE 111 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: COMPETITIVE
BENCHMARKING OF KEY STARTUPS/SMES 168
TABLE 112 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: PRODUCT LAUNCHES,
JANUARY 2021–MARCH 2026 169
TABLE 113 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: DEALS,
JANUARY 2021–MARCH 2026 170
TABLE 114 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: EXPANSIONS,
JANUARY 2021–MARCH 2026 171
TABLE 115 VERTIV GROUP CORP.: COMPANY OVERVIEW 173
TABLE 116 VERTIV GROUP CORP.: PRODUCTS OFFERED 174
TABLE 117 VERTIV GROUP CORP.: PRODUCT LAUNCHES, JANUARY 2021-MARCH 2026 175
TABLE 118 VERTIV GROUP CORP.: DEALS, JANUARY 2021-MARCH 2026 176
TABLE 119 VERTIV GROUP CORP: EXPANSIONS, JANUARY 2021-MARCH 2026 177
TABLE 120 SUPER MICRO COMPUTER, INC.: COMPANY OVERVIEW 179
TABLE 121 SUPER MICRO COMPUTER, INC.: PRODUCTS OFFERED 180
TABLE 122 SUPER MICRO COMPUTER, INC.: DEALS, JANUARY 2021-MARCH 2026 181
TABLE 123 SUPER MICRO COMPUTER, INC.: EXPANSIONS, JANUARY 2021-MARCH 2026 181
TABLE 124 MODINE MANUFACTURING COMPANY: COMPANY OVERVIEW 184
TABLE 125 MODINE MANUFACTURING COMPANY: PRODUCTS OFFERED 185
TABLE 126 MODINE MANUFACTURING COMPANY: PRODUCT LAUNCHES,
JANUARY 2021-MARCH 2026 186
TABLE 127 MODINE MANUFACTURING COMPANY: DEALS, JANUARY 2021-MARCH 2026 186
TABLE 128 MODINE MANUFACTURING COMPANY: EXPANSIONS, JANUARY 2021-MARCH 2026 187
TABLE 129 DCX LIQUID COOLING SYSTEMS: COMPANY OVERVIEW 188
TABLE 130 DCX LIQUID COOLING SYSTEMS: PRODUCTS OFFERED 188
TABLE 131 DCX LIQUID COOLING SYSTEMS: PRODUCT LAUNCHES,
JANUARY 2021-MARCH 2026 189
TABLE 132 SCHNEIDER ELECTRIC: COMPANY OVERVIEW 191
TABLE 133 SCHNEIDER ELECTRIC: PRODUCTS OFFERED 192
TABLE 134 SCHNEIDER ELECTRIC: DEALS, JANUARY 2021-MARCH 2026 193
TABLE 135 SCHNEIDER ELECTRIC: EXPANSIONS, JANUARY 2021-MARCH 2026 194
TABLE 136 FLEX LTD.: COMPANY OVERVIEW 196
TABLE 137 FLEX LTD.: PRODUCTS OFFERED 197
TABLE 138 FLEX LTD.: DEALS, JANUARY 2021-MARCH 2026 198
TABLE 139 COOLIT SYSTEMS: COMPANY OVERVIEW 199
TABLE 140 COOLIT SYSTEMS: PRODUCTS OFFERED 199
TABLE 141 COOLIT SYSTEMS: PRODUCT LAUNCHES, JANUARY 2021-MARCH 2026 200
TABLE 142 COOLIT SYSTEMS: DEALS, JANUARY 2021-MARCH 2026 201
TABLE 143 COOLIT SYSTEMS: EXPANSIONS, JANUARY 2021-MARCH 2026 202
TABLE 144 NVENT: COMPANY OVERVIEW 203
TABLE 145 NVENT: PRODUCTS OFFERED 204
TABLE 146 NVENT: DEALS, JANUARY 2021-MARCH 2026 205
TABLE 147 NVENT: EXPANSIONS, JANUARY 2021-MARCH 2026 205
TABLE 148 KAORI HEAT TREATMENT CO., LTD.: COMPANY OVERVIEW 206
TABLE 149 KAORI HEAT TREATMENT CO., LTD.: PRODUCTS OFFERED 207
TABLE 150 ZUTACORE, INC: COMPANY OVERVIEW 208
TABLE 151 ZUTACORE, INC.: PRODUCTS OFFERED 208
TABLE 152 ZUTACORE, INC.: PRODUCT LAUNCHES, JANUARY 2021-MARCH 2026 208
TABLE 153 ZUTACORE, INC.: DEALS, JANUARY 2021-MARCH 2026 209
TABLE 154 ICEOTOPE PRECISION LIQUID COOLING: COMPANY OVERVIEW 211
TABLE 155 ICEOTOPE PRECISION LIQUID COOLING: PRODUCTS OFFERED 211
TABLE 156 ICEOTOPE PRECISION LIQUID COOLING: PRODUCT LAUNCHES,
JANUARY 2021-MARCH 2026 212
TABLE 157 ICEOTOPE PRECISION LIQUID COOLING: DEALS, JANUARY 2021-MARCH 2026 213
TABLE 158 ICEOTOPE PRECISION LIQUID COOLING: EXPANSIONS,
JANUARY 2021-MARCH 2026 214
TABLE 159 BOYD: COMPANY OVERVIEW 215
TABLE 160 BOYD: PRODUCTS OFFERED 215
TABLE 161 TAISOL ELECTRONICS CO., LTD.: COMPANY OVERVIEW 216
TABLE 162 TAISOL ELECTRONICS CO., LTD.: PRODUCTS OFFERED 217
TABLE 163 WIWYNN CORPORATION: COMPANY OVERVIEW 218
TABLE 164 WIWYNN CORPORATION: PRODUCTS OFFERED 218
TABLE 165 INSPUR CO., LTD.: COMPANY OVERVIEW 219
TABLE 166 INSPUR CO., LTD.: PRODUCTS OFFERED 220
TABLE 167 LENOVO: COMPANY OVERVIEW 221
TABLE 168 LENOVO: PRODUCTS OFFERED 222
TABLE 169 LENOVO: PRODUCT LAUNCHES, JANUARY 2021-MARCH 2026 224
TABLE 170 LENOVO: DEALS, JANUARY 2021-MARCH 2026 225
TABLE 171 ACCELSIUS LLC: COMPANY OVERVIEW 226
TABLE 172 ACCELSIUS LLC: PRODUCTS OFFERED 226
TABLE 173 ACCELSIUS LLC: PRODUCT LAUNCHES, JANUARY 2021-MARCH 2026 227
TABLE 174 STULZ GMBH: COMPANY OVERVIEW 228
TABLE 175 STULZ GMBH: PRODUCTS OFFERED 228
TABLE 176 STULZ GMBH: PRODUCT LAUNCHES, JANUARY 2021-MARCH 2026 229
TABLE 177 RITTAL GMBH & CO. KG: COMPANY OVERVIEW 230
TABLE 178 RITTAL GMBH & CO. KG: PRODUCTS OFFERED 230
TABLE 179 RITTAL GMBH & CO. KG: PRODUCT LAUNCHES, JANUARY 2021-MARCH 2026 231
TABLE 180 RITTAL GMBH & CO. KG: DEALS, JANUARY 2021-MARCH 2026 231
TABLE 181 DELTA POWER SOLUTIONS: COMPANY OVERVIEW 232
TABLE 182 DELTA POWER SOLUTIONS: PRODUCTS OFFERED 233
TABLE 183 DELTA POWER SOLUTIONS: DEALS, JANUARY 2021-MARCH 2026 233
TABLE 184 LIQUIDSTACK HOLDING B.V. (TRANE TECHNOLOGIES): COMPANY OVERVIEW 234
TABLE 185 LIQUIDSTACK HOLDING B.V. (TRANE TECHNOLOGIES): PRODUCTS/SOLUTIONS/SERVICES OFFERED 234
TABLE 186 LIQUIDSTACK HOLDING B.V. (TRANE TECHNOLOGIES): PRODUCT LAUNCHES, JANUARY 2021-MARCH 2026 235
TABLE 187 LIQUIDSTACK HOLDING B.V. (TRANE TECHNOLOGIES): DEALS, JANUARY 2021-MARCH 2026 235
TABLE 188 LIQUIDSTACK HOLDING B.V. (TRANE TECHNOLOGIES): EXPANSIONS, JANUARY 2021-MARCH 2026 236
TABLE 189 LIQUIDSTACK HOLDING B.V. (TRANE TECHNOLOGIES): OTHER DEVELOPMENTS, JANUARY 2021-MARCH 2026 236
TABLE 190 CHILLDYNE, INC.: COMPANY OVERVIEW 237
TABLE 191 CHILLDYNE, INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED 237
TABLE 192 CHILLDYNE, INC.: PRODUCT LAUNCHES, JANUARY 2021-MARCH 2026 238
TABLE 193 CHILLDYNE, INC.: DEALS, JANUARY 2021-MARCH 2026 239
TABLE 194 MALICO INC.: COMPANY OVERVIEW 240
TABLE 195 MALICO INC: PRODUCTS/SOLUTIONS/SERVICES OFFERED 240
TABLE 196 KOOLANCE, INC.: COMPANY OVERVIEW 241
TABLE 197 GIGA-BYTE TECHNOLOGY CO., LTD.: COMPANY OVERVIEW 241
TABLE 198 OPTICOOL TECHNOLOGIES: COMPANY OVERVIEW 242
TABLE 199 SEGUENTE INC.: COMPANY OVERVIEW 242
TABLE 200 COOLCENTRIC: COMPANY OVERVIEW 243

List of Figures

FIGURE 1 DATA CENTER DIRECT-TO-CHIP COOLING MARKET SEGMENTATION
AND REGIONAL SCOPE 25
FIGURE 2 KEY INSIGHTS AND MARKET HIGHLIGHTS 28
FIGURE 3 GLOBAL DATA CENTER DIRECT-TO-CHIP COOLING MARKET, 2026–2032 29
FIGURE 4 MAJOR STRATEGIES ADOPTED BY KEY PLAYERS IN DATA CENTER DIRECT-TO-CHIP COOLING MARKET (2020–2025) 29
FIGURE 5 DISRUPTIVE TRENDS IMPACTING GROWTH OF DATA CENTER DIRECT-TO-CHIP COOLING MARKET 30
FIGURE 6 HIGH-GROWTH SEGMENTS IN DATA CENTER DIRECT-TO-CHIP COOLING MARKET 30
FIGURE 7 ASIA PACIFIC TO EXHIBIT FASTEST GROWTH DURING FORECAST PERIOD 31
FIGURE 8 RAPID ADOPTION OF AI, ML, AND BLOCKCHAIN TECHNOLOGIES TO CREATE LUCRATIVE OPPORTUNITIES FOR MARKET PLAYERS 32
FIGURE 9 HYPERSCALE DATA CENTERS TO BE LARGEST SEGMENT DURING
FORECAST PERIOD 32
FIGURE 10 SINGLE PHASE TO LEAD OVERALL MARKET DURING FORECAST PERIOD 33
FIGURE 11 NORTH AMERICA TO DOMINATE GLOBAL DATA CENTER DIRECT-TO-CHIP
COOLING MARKET 33
FIGURE 12 CHINA TO BE FASTEST-GROWING MARKET DURING FORECAST PERIOD 34
FIGURE 13 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES 35
FIGURE 14 ESTIMATED GLOBAL DATA CENTER CAPACITY DEMAND 36
FIGURE 15 INCREASE IN POWER DENSITIES IN DATA CENTERS (KW PER RACK) 37
FIGURE 16 DATA CENTER POWER DENSITIES, BY DEPLOYMENT TYPE (KW PER RACK) 38
FIGURE 17 POWER USAGE EFFECTIVENESS 39
FIGURE 18 GROWTH OF GLOBAL EDGE DATA CENTERS MARKET 41
FIGURE 19 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: PORTER’S FIVE
FORCES ANALYSIS 49
FIGURE 20 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: VALUE CHAIN ANALYSIS 56
FIGURE 21 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: ECOSYSTEM ANALYSIS 58
FIGURE 22 TRENDS AND DISRUPTIONS IMPACTING CUSTOMER BUSINESS 61
FIGURE 23 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: INVESTMENT AND FUNDING SCENARIO, 2019–2024 62
FIGURE 24 FUTURE APPLICATIONS OF DATA CENTER DIRECT-TO-CHIP COOLING MARKET 65
FIGURE 25 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: DECISION-MAKING FACTORS 86
FIGURE 26 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS, BY END USER 87
FIGURE 27 KEY BUYING CRITERIA, BY END USER 88
FIGURE 28 ADOPTION BARRIERS & INTERNAL CHALLENGES 90
FIGURE 29 SINGLE-PHASE TO BE FASTER-GROWING SEGMENT DURING FORECAST PERIOD 97
FIGURE 30 HYPERSCALE DATA CENTERS TO BE FASTEST-GROWING SEGMENT
DURING FORECAST PERIOD 102
FIGURE 31 NORTH AMERICA TO ACCOUNT FOR LARGEST MARKET SHARE DURING
FORECAST PERIOD 108
FIGURE 32 NORTH AMERICA: DATA CENTER DIRECT-TO-CHIP COOLING MARKET SNAPSHOT 110
FIGURE 33 ASIA PACIFIC: DATA CENTER DIRECT-TO-CHIP COOLING MARKET SNAPSHOT 116
FIGURE 34 EUROPE: DATA CENTER DIRECT-TO-CHIP COOLING MARKET SNAPSHOT 130
FIGURE 35 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: REVENUE ANALYSIS
OF KEY COMPANIES, 2020–2024 152
FIGURE 36 RANKING OF KEY PLAYERS IN DATA CENTER DIRECT-TO-CHIP COOLING MARKET 153
FIGURE 37 DATA CENTER DIRECT-TO-CHIP COOLING MARKET SHARE ANALYSIS, 2025 153
FIGURE 38 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: BRAND/PRODUCT COMPARISON 156
FIGURE 39 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: EV/EBITDA 158
FIGURE 40 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: EV/REVENUE 158
FIGURE 41 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: YEAR-TO-DATE (YTD) PRICE TOTAL RETURN AND FIVE-YEAR STOCK BETA OF KEY MANUFACTURERS 159
FIGURE 42 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: COMPANY EVALUATION MATRIX (KEY PLAYERS), 2025 160
FIGURE 43 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: COMPANY FOOTPRINT 161
FIGURE 44 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: COMPANY EVALUATION MATRIX (STARTUPS/SMES), 2025 167
FIGURE 45 VERTIV GROUP CORP.: COMPANY SNAPSHOT 174
FIGURE 46 SUPER MICRO COMPUTER, INC.: COMPANY SNAPSHOT 180
FIGURE 47 MODINE MANUFACTURING COMPANY: COMPANY SNAPSHOT 185
FIGURE 48 SCHNEIDER ELECTRIC: COMPANY SNAPSHOT 192
FIGURE 49 FLEX LTD.: COMPANY SNAPSHOT 197
FIGURE 50 NVENT: COMPANY SNAPSHOT 204
FIGURE 51 KAORI HEAT TREATMENT CO., LTD.: COMPANY SNAPSHOT 206
FIGURE 52 TAISOL ELECTRONICS CO., LTD.: COMPANY SNAPSHOT 217
FIGURE 53 WIWYNN CORPORATION: COMPANY SNAPSHOT 218
FIGURE 54 INSPUR CO., LTD.: COMPANY SNAPSHOT 219
FIGURE 55 LENOVO: COMPANY SNAPSHOT 222
FIGURE 56 DELTA POWER SOLUTIONS: COMPANY SNAPSHOT 232
FIGURE 57 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: RESEARCH DESIGN 244
FIGURE 58 MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH 248
FIGURE 59 MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH 249
FIGURE 60 MAIN MATRIX CONSIDERED TO ASSESS DEMAND FOR DATA CENTER
DIRECT-TO-CHIP COOLING 249
FIGURE 61 STEPS CONSIDERED TO ANALYZE SUPPLY OF DATA CENTER DIRECT-
TO-CHIP COOLING 250
FIGURE 62 DATA CENTER DIRECT-TO-CHIP COOLING MARKET: DATA TRIANGULATION 251

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