| 出版社 | IMARC Group |
| 出版年月 | 2025年4月 |
Semiconductor Packaging Market Size, Share, Trends and Forecast
The global semiconductor packaging market size was valued at USD 37.5 Billion in 2024. Looking forward, IMARC Group estimates the market to reach USD 68.2 Billion by 2033, exhibiting a CAGR of 6.81% from 2025-2033. Asia Pacific currently dominates the market, holding a market share of over 54.3% in 2024. Substantial investments in leading-edge packaging technologies, resilient semiconductor manufacturing landscape, and magnifying need for consumer electronics, are contributing to the semiconductor packaging market share expansion.
世界の半導体パッケージング市場規模は、2024年には375億米ドルと評価されました。IMARCグループは、今後、市場規模は2033年までに682億米ドルに達し、2025年から2033年にかけて6.81%の年平均成長率（CAGR）で成長すると予測しています。現在、アジア太平洋地域が市場を支配しており、2024年には54.3%を超える市場シェアを獲得しています。最先端のパッケージング技術への多額の投資、堅調な半導体製造環境、そして民生用電子機器の需要拡大が、半導体パッケージング市場のシェア拡大に貢献しています。
Semiconductor Packaging Market Report Scope:
| Report Features | Details |
|---|---|
| Base Year of the Analysis | 2024 |
| Historical Period | 2019-2024 |
| Forecast Period | 2025-2033 |
| Units | Billion USD |
| Scope of the Report | Exploration of Historical Trends and Market Outlook, Industry Catalysts and Challenges, Segment-Wise Historical and Future Market Assessment:
|
| Types Covered | Flip Chip, Embedded DIE, Fan-in WLP, Fan-out WLP |
| Packaging Materials Covered | Organic Substrate, Bonding Wire, Leadframe, Ceramic Package, Die Attach Material, Others |
| Technologies Covered | Grid Array, Small Outline Package, Flat no-leads Package, Dual In-Line Package, Others |
| End Users Covered | Consumer Electronics, Automotive, Healthcare, IT and Telecommunicaton, Aerospace and Defense, Others |
| Regions Covered | Asia Pacific, Europe, North America, Latin America, Middle East and Africa |
| Countries Covered | United States, Canada, Germany, France, United Kingdom, Italy, Spain, Russia, China, Japan, India, South Korea, Australia, Indonesia, Brazil, Mexico |
| Companies Covered | Amkor Technology Inc., ASE Group, ChipMOS Technologies Inc., Fujitsu Limited, Intel Corporation, International Business Machines Corporation, Jiangsu Changjiang Electronics Technology Co., Ltd., Powertech Technology Inc., Qualcomm Incorporated, Samsung Electronics Co. Ltd., STMicroelectronics International N.V., Taiwan Semiconductor Manufacturing Company Limited, Texas Instruments Incorporated, etc. |
| Customization Scope | 10% Free Customization |
| Post-Sale Analyst Support | 10-12 Weeks |
| Delivery Format | PDF and Excel through Email (We can also provide the editable version of the report in PPT/Word format on special request) |
Key Questions Answered in This Report
1.How big is the semiconductor packaging market?
2.What is the future outlook of semiconductor packaging market?
3.What are the key factors driving the semiconductor packaging market?
4.Which region accounts for the largest semiconductor packaging market share?
5.Which are the leading companies in the global semiconductor packaging market?