Advanced Chip Packaging Technologies: Global Market
| 出版 | BCC Research |
| 出版年月 | 2026年06月 |
| ページ数 | 136 |
| 価格 | 記載以外のライセンスについてはお問合せください |
| シングルユーザ | USD 4,650 |
| 種別 | 英文調査報告書 |
| 商品番号 | SMR-24401 |
先端チップパッケージングの世界市場規模は2025年に438億ドルとなり、2025年から2030年にかけて年平均成長率（CAGR）14.8%で推移し、2027年には570億ドル、2030年には876億ドルに達するとBCC Researchでは予測しています。
本レポートの主な内容：
- 39のデータ表および50の追加表
- 先端チップパッケージング技術に関する世界市場の概要
- 世界市場の動向に関する詳細な分析（2024年の実績データ、2025年の推定値、および2027年・2029年の予測を含む）。これには2030年までの年平均成長率（CAGR）の予測も含まれます
- 先端チップパッケージング技術に特化した市場規模および収益成長見通しの評価、ならびに技術、用途、地域別の市場シェア分析
- 先端チップパッケージングの世界市場における現在および将来の需要分析、ならびに競争環境、市場規制、償還制度に関する詳細な分析
- 市場の成長に影響を与える促進要因、課題、および機会の分析
- 技術の進化、現在および将来の市場ポテンシャル、研究開発（R&D）活動、成長戦略、新製品パイプライン、規制の枠組みと償還シナリオ、および市場におけるESG（環境・社会・ガバナンス）動向の網羅的な解説
- 先端チップパッケージング業界の主要参入企業に関する市場シェア分析、および各社の研究開発の優先事項、製品ポートフォリオ、世界ランキング、競争環境の分析
- 業界の主要企業（Taiwan Semiconductor Manufacturing Co. Ltd. [TSMC]、Amkor Technology、ASE、Intel Corp.など）の企業概要
本レポートは、世界の先端チップパッケージング技術市場の概要を提示し、セグメント別および地域別の世界売上高（百万米ドル）を含む市場動向を分析しています。基準年は2024年とし、2025年から2030年までの市場予測データを掲載しています。市場は技術、用途、地域別に区分されています。対象地域は、北米、欧州、アジア太平洋、およびその他の地域（Rest of the World）です。また、本レポートでは新興技術やベンダーの状況にも焦点を当て、最後に主要企業の企業概要をまとめています。
Report Highlights
The global market for advanced chip packaging was valued at $43.8 billion in 2025 and, is estimated to reach $57 billion by 2027 and $87.6 billion by 2030, at a compound annual growth rate (CAGR) of 14.8% from 2025 through 2030.
Report Includes
- 39 data tables and 50 additional tables
- An overview of the global market for advanced chip packaging technologies
- In-depth analysis of global market trends, featuring historical revenue data for 2024, estimated figures for 2025, as well as forecasts for 2027, 2029. This analysis includes projections of compound annual growth rates (CAGRs) through 2030
- Evaluation of the current market size and revenue growth prospects specific to the advanced chip packaging technologies, accompanied by a market share analysis by technology, application, and region
- Analysis of current and future demand in the global advanced chip packaging, along with a detailed analysis of the competitive environment, market regulations and reimbursement practices
- Analysis of drivers, challenges, and opportunities affecting market growth
- Coverage of evolving technologies, the current and future market potential, R&D activities, growth strategies, new product pipeline, regulatory framework and reimbursement scenarios, and ESG trends of the market
- Market share analysis of the key market participants in the advanced chip packaging industry, along with their research priorities, product portfolios, global rankings and company competitive landscape
- Company profiles of major players within the industry, including Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), Amkor Technology, ASE, and Intel Corp.
Report Scope
This report provides an overview of the global advanced chip packaging technologies market and analyzes market trends, including global revenue (in $ millions) for segments and regions. The base year is 2024, with estimated market data for 2025 through 2030. The market is segmented by technology, application, and region. The geographical segments covered are North America, Europe, Asia-Pacific, and the Rest of the World. The report also focuses on emerging technologies and the vendor landscape, and concludes with profiles of the major companies in the market.
Report Synopsis
| Report Metrics | Details | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Base year considered | 2024 | ||||||||||||||||
| Forecast period considered | 2025-2030 | ||||||||||||||||
| Base year market size | $38.6 billion | ||||||||||||||||
| Market size forecast | $87.6 billion | ||||||||||||||||
| Growth rate | CAGR of 14.8% for the forecast period of 2025-2030 | ||||||||||||||||
| Units considered | $ Millions | ||||||||||||||||
| Segments covered | Technology, Application | ||||||||||||||||
| Regions covered | North America, Europe, Asia-Pacific, Rest of the World | ||||||||||||||||
| Countries covered | U.S., Canada, Mexico, France, Germany, Netherlands, Italy, Belgium, Spain, China, Japan, Taiwan, South Korea, Australia, New Zealand (ANZ), South America, Middle East and Africa | ||||||||||||||||
| Key Market Drivers |
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| Companies studied |
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Table of Contents
Chapter 1 Executive Summary
Market Outlook
Scope of Report
Market Summary
Market Dynamics and Growth Factors
Emerging Technologies
Segmental Analysis
Regional Insights and Emerging Markets
Conclusion
Chapter 2 Market Overview
Current Market Scenario
Future Outlook
Macroeconomic Factors Analysis
Global Economic Uncertainty and Supply Chain Disruptions
Inflationary Pressures and Interest Rate Volatility
Trade Policy Shifts
Impact of the U.S. Tariff on the Advanced Chip Packaging Market
Porter’s Five Forces Analysis
Threat of New Entrants
Bargaining Power of Suppliers
Bargaining Power of Buyers
Threat of Substitutes
Competitive Rivalry
Value Chain Analysis
Raw and Substrate Materials
Semiconductor Wafer Supply
Package Design and Electronic Design Automation (EDA) Tools
Advanced Chip Packaging Equipment (Assembly and Bonding)
Wafer Processing and Dicing Equipment
Testing and Inspection Equipment
Outsourced Semiconductor Assembly and Test (OSAT)
End-Use Integration and Original Equipment Manufacturers (OEMs)
Regulatory Landscape
Chapter 3 Market Dynamics
Key Takeaways
Market Drivers
Exponential Growth in AI and HPC Demand
Miniaturization and Heterogeneous Integration Requirements
Vehicle Electrification and Automotive Electronics Expansion
Market Restraints
High Capital Investment and Infrastructure Requirements
Complex Yield Management and Thermal Challenges in Multi-Chiplet Integration
Market Opportunities
Expansion of 5G/6G Infrastructure and AI-Native Wireless Networks
Smart Cities and IoT Ecosystem Development
AR/VR/MR Applications and Immersive Technologies
Chapter 4 Emerging Trends and Technologies
Overview
Emerging Trends
GenAI and HPC Fuel Advanced Packaging Demand
Geographical Expansion and Localized Manufacturing
Shift from Wafer-Level to Panel-Level Packaging
AI-Driven Infrastructure Expansion Accelerating Advanced Packaging Capacity
Emerging Technologies
2.5D and 3D Stacking Technologies
Heterogeneous Integration
Patent Analysis
Geographical Patterns
Chapter 5 Market Segmentation Analysis
Segmentation Breakdown
Market Breakdown by Technology
Key Takeaways
2.5D/3D Packaging
Flip-Chip
Fan-Out WLP
System-in-Package (SiP)
Embedded Die
Others
Market Breakdown by Application
Key Takeaways
AI and High-Performance Computing
Smartphones and Mobile Devices
Telecom and Infrastructure
Automotive
Others
Geographic Breakdown
Market Breakdown by Region
Key Takeaways
North America
Asia-Pacific
Europe
Rest of the World
Chapter 6 Competitive Intelligence
Key Takeaways
Market Ecosystem Analysis
Analysis of Key Companies
TSMC
Amkor Technology
ASE Technology Holding
Intel Corp.
JCET Group Co. Ltd.
Strategic Analysis
Chapter 7 Appendix
Methodology
Abbreviations
Company Profiles
AMKOR TECHNOLOGY
ASE
CHIPMOS TECHNOLOGIES INC.
HANA MICRON INC.
INTEL CORP.
JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO. LTD.
KING YUAN ELECTRONICS CO. LTD.
POWERTECH TECHNOLOGY INC.
SAMSUNG
SILICON BOX PTE LTD.
SILICONWARE PRECISION INDUSTRIES Co. Ltd.
STATS CHIPPAC MANAGEMENT PTE. LTD.
TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
TIANSHUI HUATIAN TECHNOLOGY CO. LTD.
TONGFU MICROELECTRONICS CO. LTD.
UNISEM
List of Tables
Summary Table : Global Market for Advanced Chip Packaging Technologies, by Application, Through 2030
Table 1 : Regional Regulatory Bodies, Standards Organizations, and Government Agencies for Advanced Chip Packaging Technologies, 2024
Table 2 : Granted Patents for Advanced Chip Packaging Technologies, by Inventor or Assignee, December 2023–August 2025
Table 3 : Global Market for Advanced Chip Packaging Technologies, by Technology, Through 2030
Table 4 : Global Market for 2.5D/3D Chip Packaging Technology, by Region, Through 2030
Table 5 : Global Market for Flip-Chip Packaging Technology, by Region, Through 2030
Table 6 : Global Market for Fan-Out WLP Chip Packaging Technology, by Region, Through 2030
Table 7 : Global Market for System-in-Package Chip Packaging Technology, by Region, Through 2030
Table 8 : Global Market for Embedded Die Chip Packaging Technology, by Region, Through 2030
Table 9 : Global Market for Other Chip Packaging Technologies, by Region, Through 2030
Table 10 : Global Market for Advanced Chip Packaging Technologies, by Application, Through 2030
Table 11 : Global Market for Advanced Chip Packaging for AI and High-Performance Computing, by Region, Through 2030
Table 12 : Global Market for Advanced Chip Packaging for Smartphones and Mobile Devices, by Region, Through 2030
Table 13 : Global Market for Advanced Chip Packaging for Telecom and Infrastructure, by Region, Through 2030
Table 14 : Global Market for Advanced Chip Packaging for Automotive, by Region, Through 2030
Table 15 : Global Market for Advanced Chip Packaging for Other Applications, by Region, Through 2030
Table 16 : Global Market for Advanced Chip Packaging Technologies, by Region, Through 2030
Table 17 : North American Market for Advanced Chip Packaging Technologies, by Country, Through 2030
Table 18 : North American Market for Advanced Chip Packaging Technologies, by Technology, Through 2030
Table 19 : North American Market for Advanced Chip Packaging Technologies, by Application, Through 2030
Table 20 : Asia-Pacific Market for Advanced Chip Packaging Technologies, by Country, Through 2030
Table 21 : Asia-Pacific Market for Advanced Chip Packaging Technologies, by Technology, Through 2030
Table 22 : Asia-Pacific Market for Advanced Chip Packaging Technologies, by Application, Through 2030
Table 23 : European Market for Advanced Chip Packaging Technologies, by Country, Through 2030
Table 24 : European Market for Advanced Chip Packaging Technologies, by Technology, Through 2030
Table 25 : European Market for Advanced Chip Packaging Technologies, by Application, Through 2030
Table 26 : RoW Market for Advanced Chip Packaging Technologies, by Sub-Region, Through 2030
Table 27 : RoW Market for Advanced Chip Packaging Technologies, by Technology, Through 2030
Table 28 : RoW Market for Advanced Chip Packaging Technologies, by Application, Through 2030
Table 29 : Global Market Shares for Advanced Chip Packaging Technologies by Key Companies, 2024
Table 30 : Global Advanced Chip Packaging Technologies Market: Key Recent Developments, 2023 to 2026
Table 31 : Abbreviations Used in the Report
Table 32 : Amkor Technology: Company Snapshot
Table 33 : Amkor Technology: Financial Performance, FY 2023 and 2024
Table 34 : Amkor Technology: Product Portfolio
Table 35 : Amkor Technology: News/Key Developments, 2025
Table 36 : ASE: Company Snapshot
Table 37 : ASE: Product Portfolio
Table 38 : ASE: News/Key Developments, 2025
Table 39 : ChipMOS Technologies Inc.: Company Snapshot
Table 40 : ChipMOS Technologies Inc.: Financial Performance, FY 2023 and 2024
Table 41 : ChipMOS Technologies Inc.: Product Portfolio
Table 42 : ChipMOS Technologies Inc.: News/Key Developments, 2024
Table 43 : HANA Micron Inc.: Company Snapshot
Table 44 : HANA Micron Inc.: Financial Performance, FY 2023 and 2024
Table 45 : HANA Micron Inc.: Product Portfolio
Table 46 : HANA Micron Inc.: News/Key Developments, 2026
Table 47 : Intel Corp.: Company Snapshot
Table 48 : Intel Corp.: Financial Performance, FY 2023 and 2024
Table 49 : Intel Corp.: Product Portfolio
Table 50 : Intel Corp.: News/Key Developments, 2025
Table 51 : Jiangsu Changjiang Electronics Technology Co. Ltd.: Company Snapshot
Table 52 : Jiangsu Changjiang Electronics Technology Co. Ltd.: Financial Performance, FY 2023 and 2024
Table 53 : Jiangsu Changjiang Electronics Technology Co. Ltd.: Product Portfolio
Table 54 : King Yuan Electronics Co. Ltd.: Company Snapshot
Table 55 : King Yuan Electronics Co. Ltd.: Financial Performance, FY 2023 and 2024
Table 56 : King Yuan Electronics Co. Ltd.: Product Portfolio
Table 57 : Powertech Technology Inc.: Company Snapshot
Table 58 : Powertech Technology Inc.: Financial Performance, FY 2023 and 2024
Table 59 : Powertech Technology Inc.: Product Portfolio
Table 60 : Powertech Technology Inc.: News/Key Developments, 2023–2025
Table 61 : Samsung: Company Snapshot
Table 62 : Samsung: Financial Performance, FY 2023 and 2024
Table 63 : Samsung: Product Portfolio
Table 64 : Samsung: News/Key Developments, 2023–2025
Table 65 : Silicon Box Pte Ltd.: Company Snapshot
Table 66 : Silicon Box Pte Ltd.: Product Portfolio
Table 67 : Silicon Box Pte Ltd.: News/Key Developments, 2023–2024
Table 68 : Siliconware Precision Industries Co. Ltd.: Company Snapshot
Table 69 : Siliconware Precision Industries Co. Ltd.: Product Portfolio
Table 70 : Siliconware Precision Industries Co. Ltd.: News/Key Developments, 2024
Table 71 : STATS ChipPAC Management Pte. Ltd.: Company Snapshot
Table 72 : STATS ChipPAC Management Pte. Ltd.: Product Portfolio
Table 73 : STATS ChipPAC Management Pte. Ltd.: News/Key Developments, 2025
Table 74 : Taiwan Semiconductor Manufacturing Co. Ltd.: Company Snapshot
Table 75 : Taiwan Semiconductor Manufacturing Co. Ltd.: Financial Performance, FY 2023 and 2024
Table 76 : Taiwan Semiconductor Manufacturing Co. Ltd.: Product Portfolio
Table 77 : Taiwan Semiconductor Manufacturing Co. Ltd.: News/Key Developments, 2024–2025
Table 78 : Tianshui Huatian Technology Co. Ltd.: Company Snapshot
Table 79 : Tianshui Huatian Technology Co. Ltd.: Financial Performance, FY 2023 and 2024
Table 80 : Tianshui Huatian Technology Co. Ltd.: Product Portfolio
Table 81 : Tianshui Huatian Technology Co. Ltd.: News/Key Developments, 2023–2024
Table 82 : Tongfu Microelectronics Co. Ltd.: Company Snapshot
Table 83 : Tongfu Microelectronics Co. Ltd.: Financial Performance, FY 2023 and 2024
Table 84 : Tongfu Microelectronics Co. Ltd.: Product Portfolio
Table 85 : Tongfu Microelectronics Co. Ltd.: News/Key Developments, 2023–2025
Table 86 : Unisem: Company Snapshot
Table 87 : Unisem: Financial Performance, FY 2023 and 2024
Table 88 : Unisem: Product Portfolio
List of Figures
Summary Figure : Global Market Shares for Advanced Chip Packaging Technologies, by Application, 2024
Figure 1 : Value Chain for Advanced Chip Packaging Technologies Market
Figure 2 : Market Dynamics of Advanced Chip Packaging Technologies
Figure 3 : Patent Shares for Advanced Chip Packaging Technologies, by Applicants in Key Regions, October 2023–November 2025
Figure 4 : Global Market Shares for Advanced Chip Packaging Technologies, by Technology, 2024
Figure 5 : Global Market Shares for 2.5D/3D Chip Packaging Technology, by Region, 2024
Figure 6 : Global Market Shares for Flip-Chip Packaging Technology, by Region, 2024
Figure 7 : Global Market Shares for Fan-Out WLP Chip Packaging Technology, by Region, 2024
Figure 8 : Global Market Shares for System-in-Package (SiP) Chip Packaging Technology, by Region, 2024
Figure 9 : Global Market Shares for Embedded Die Chip Packaging Technology, by Region, 2024
Figure 10 : Global Market Shares for Other Chip Packaging Technologies, by Region, 2024
Figure 11 : Global Market Shares for Advanced Chip Packaging Technologies, by Application, 2024
Figure 12 : Global Market Shares for Advanced Chip Packaging for AI and High-Performance Computing, by Region, 2024
Figure 13 : Global Market Shares for Advanced Chip Packaging for Smartphones and Mobile Devices, by Region, 2024
Figure 14 : Global Market Shares for Advanced Chip Packaging for Telecom and Infrastructure, by Region, 2024
Figure 15 : Global Market Shares for Advanced Chip Packaging for Automotive, by Region, 2024
Figure 16 : Global Market Shares for Advanced Chip Packaging for Other Applications, by Region, 2024
Figure 17 : Global Market Shares for Advanced Chip Packaging Technologies, by Region, 2024
Figure 18 : Global Advanced Chip Packaging Technologies Market Ecosystem
Figure 19 : Amkor Technology: Revenue Shares, by Business Unit, FY 2024
Figure 20 : Amkor Technology: Revenue Shares, by Country/Region, FY 2024
Figure 21 : ChipMOS Technologies Inc.: Revenue Shares, by Business Unit, FY 2024
Figure 22 : ChipMOS Technologies Inc.: Revenue Shares, by Region, FY 2024
Figure 23 : HANA Micron Inc.: Revenue Shares, by Business Unit, FY 2024
Figure 24 : HANA Micron Inc.: Revenue Shares, by Region, FY 2024
Figure 25 : Intel Corp.: Revenue Shares, by Business Unit, FY 2024
Figure 26 : Intel Corp.: Revenue Shares, by Region, FY 2024
Figure 27 : Jiangsu Changjiang Electronics Technology Co. Ltd.: Revenue Shares, by Business Unit, FY 2024
Figure 28 : Jiangsu Changjiang Electronics Technology Co. Ltd.: Revenue Shares, by Region, FY 2024
Figure 29 : King Yuan Electronics Co. Ltd.: Revenue Shares, by Business Unit, FY 2024
Figure 30 : King Yuan Electronics Co. Ltd.: Revenue Shares, by Region, FY 2024
Figure 31 : Powertech Technology Inc.: Revenue Shares, by Business Unit, FY 2024
Figure 32 : Powertech Technology Inc.: Revenue Shares, by Region, FY 2024
Figure 33 : Samsung: Revenue Shares, by Business Unit, FY 2024
Figure 34 : Samsung: Revenue Shares, by Region, FY 2024
Figure 35 : Taiwan Semiconductor Manufacturing Co. Ltd.: Revenue Shares, by Business Unit, FY 2024
Figure 36 : Taiwan Semiconductor Manufacturing Co. Ltd.: Revenue Shares, by Region, FY 2024
Figure 37 : Tianshui Huatian Technology Co. Ltd.: Revenue Shares, by Business Unit, FY 2024
Figure 38 : Tianshui Huatian Technology Co. Ltd.: Revenue Shares, by Country/Region, FY 2024
Figure 39 : Tongfu Microelectronics Co. Ltd.: Revenue Shares, by Business Unit, FY 2024
Figure 40 : Tongfu Microelectronics Co. Ltd.: Revenue Shares, by Region, FY 2024
Figure 41 : Unisem: Revenue Shares, by Country/Region, FY 2024